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A kind of growth method of high-quality aluminum nitride single crystal

A growth method and aluminum nitride technology, applied in the direction of single crystal growth, single crystal growth, crystal growth, etc., can solve problems such as reducing crystal quality, and achieve the effect of reducing growth stress

Active Publication Date: 2021-04-27
BEIJING HUAJINCHUANGWEI ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such defects further degrade the crystal quality in AlN crystal growth, resulting in a large number of defects and even polycrystalline

Method used

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  • A kind of growth method of high-quality aluminum nitride single crystal

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Embodiment Construction

[0022] The present invention will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of the invention are shown. This invention may, however, be embodied in many different forms and should not be construed as limited to the exemplary embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0023] Such as figure 1 As shown, the present invention provides a kind of growth method of high-quality aluminum nitride single crystal, and this method comprises the steps:

[0024] 1) Put the material source into the tantalum carbide crucible 9, the first layer of the filler layer from bottom to top is an aluminum nitride powder layer 8 with a purity of 99.9%; the second layer is an aluminum nitride powder layer with a purity of 99.9% After sintering, the particle layer 7; the third layer i...

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Abstract

The invention discloses a method for growing a high-quality aluminum nitride single crystal. In the method, the initial deposition layer adopts a large aluminum nitride / silicon carbide mixed filler mode, and then high-purity aluminum nitride powder is used, and the temperature changes during the growth process. The aluminum nitride filler layer in the crucible is from bottom to top. The first layer is the aluminum nitride powder layer, the second layer is the sintered aluminum nitride particle layer, and the third layer is the particle mixture of aluminum nitride and silicon carbide. material, and the fourth layer is a source of particle mixture of aluminum nitride and silicon carbide. In the present invention, by doping silicon carbide powder in aluminum nitride powder, different silicon carbide: aluminum nitride ratios are used in different interlayers to relieve the growth stress between the silicon carbide substrate and the aluminum nitride single crystal, and to grow In the process, the process of variable temperature and pressure is adopted to control the heating and cooling speed. The source body is from top to bottom, and the silicon carbide composition gradually decreases. By adjusting the concentration of silicon carbide in the source, the silicon carbide in the aluminum nitride single crystal is adjusted. content, so as to reduce the growth stress of aluminum nitride single crystal.

Description

technical field [0001] The invention relates to the field of growing aluminum nitride single crystals by a physical meteorological transmission method, in particular to a growth method for high-quality aluminum nitride single crystals. Background technique [0002] Aluminum nitride has a large band gap, up to 6.2eV, and high thermal conductivity. It is excellent as a light-emitting element in the ultraviolet region and a substrate material for electronic devices. Now the more common method of producing aluminum nitride single crystal is physical meteorological transport (PVT) method. Previously, the self-nucleation growth method was used to obtain aluminum nitride single crystals. However, due to the narrow growth window and high growth temperature of aluminum nitride single crystals, the current silicon carbide single crystal substrate can effectively control the crystal growth direction. However, the use of this heterogeneous substrate results in large thermal and lattice...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B29/40C30B23/00
CPCC30B23/00C30B29/403
Inventor 杨丽雯程章勇刘欣宇杨雷雷
Owner BEIJING HUAJINCHUANGWEI ELECTRONICS CO LTD
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