High power LED lamp capable of conducting liquid-cooled heat transferring and air-cooled heat dissipating
An air-cooled and liquid-cooled technology, applied in cooling/heating devices of lighting devices, lighting and heating equipment, lighting devices, etc., can solve the problems of volume and weight reduction, achieve advanced production technology, reduce thermal resistance, and reduce heat dissipation volume effect
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Embodiment 1
[0040] Embodiment 1. A liquid-cooled heat transfer and air-cooled heat dissipation high-power LED lamp
[0041] like figure 1 As shown, it is a schematic structural diagram of a liquid-cooled heat transfer and air-cooled heat dissipation high-power LED lamp of the present invention, which includes an LED light source, a liquid-cooled heat transfer system, an air-cooled heat dissipation system and a driving power supply 5 .
[0042] The LED light-emitting light source includes a chip, a fluorescent material layer 2, and a light source substrate 11 arranged in sequence from top to bottom; lines are arranged on one side of the light source substrate 11 and a crystal-bonding area is set, and a heat-conducting adhesive is coated on the other side, and is surrounded along the edge of the crystal-bonding area. The dam glue 10; the chips are placed on the die-bonding area.
[0043] The liquid-cooled heat transfer system includes a heat conduction chamber 3, a liquid conduit 9 and a p...
Embodiment 2
[0048] Example 2. Preparation of a liquid-cooled heat transfer and air-cooled heat dissipation high-power LED lamp
[0049] The specific steps of preparation are as follows:
[0050] 1) On one side of the aluminum nitride substrate, corresponding circuit lines and crystal bonding areas are set by screen printing, and the honeycomb solderable layer is printed on the other side of the aluminum nitride substrate by silk screen;
[0051] 2) Fix the flip-chip LED chip on the crystal-bonding area of the aluminum nitride ceramic substrate by using a crystal-bonding machine;
[0052] 3) The aluminum nitride substrate on which the flip chip is fixed is eutectically welded through the eutectic furnace to complete the eutectic process and form a blue light source;
[0053] 4) The blue light source passes through the dispensing machine to enclose the dam glue along the crystal-bonding area and form a retaining wall structure, bake at 150°C for 1 hour, and cool;
[0054] 5) Mount the f...
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