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Polyimide film

A polyimide film and film-forming technology, which can be applied to other household appliances, synthetic resin layered products, chemical instruments and methods, etc., can solve the problems of component loading position deviation, component and substrate can not be well connected, etc., to achieve The effect of small elongation on one side

Inactive Publication Date: 2018-04-06
DUPONT TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when the dimensional change after the formation of fine wiring becomes large, there is a problem that the component mounting position is shifted from the design stage, and the component and the substrate cannot be connected satisfactorily.

Method used

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  • Polyimide film
  • Polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～5

[0150] Prepare pyromellitic dianhydride (PMPA, molecular weight 218.12) / 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA, molecular weight 294.22) / 4 at a molar ratio of 65 / 35 / 60 / 40 ,4'-diaminodiphenyl ether (DPE, molecular weight 200.24) / p-phenylenediamine (PPD, molecular weight 108.14), formed 20% by weight in DMAC (N,N-dimethylacetamide) and polymerized to give 3500 poise polyamic acid solution at 25°C.

[0151] After adding β-picoline and acetic anhydride to the polyamide solution so that the molar ratio of each relative to the polyamic acid was 3.0, it was cast from a metal port onto a stainless steel support at 90°C to obtain a self-supporting polyamide solution. polyimide gel membrane.

[0152]The gel film was peeled from the support, conveyed through nip rolls, and stretched longitudinally. After longitudinal stretching, both ends of the film were held, and drying was carried out in a tenter while stretching laterally. After drying, it heat-processed using an elec...

reference example 1

[0155] Prepare pyromellitic dianhydride (PMPA, molecular weight 218.12) / 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA, molecular weight 294.22) / 4 at a molar ratio of 75 / 25 / 60 / 40 ,4'-diaminodiphenyl ether (DPE, molecular weight 200.24) / p-phenylenediamine (PPD, molecular weight 108.14), formed 20% by weight in DMAC (N,N-dimethylacetamide) and polymerized to give A polyamic acid solution of 3500 poise at 25°C was obtained.

[0156] After adding β-picoline and acetic anhydride to the polyamide solution so that the molar ratio of each relative to the polyamic acid was 3.3, it was cast on a stainless steel support at 75°C to obtain a self-supporting polyimide. Amine gel film.

[0157] The gel film was peeled from the support, conveyed through nip rolls, and stretched longitudinally. After longitudinal stretching, both ends of the film were held, and drying was carried out in a tenter while stretching laterally. After drying, it heat-processed using an electric heater, and o...

reference example 2

[0159] Prepare pyromellitic dianhydride (PMPA, molecular weight 218.12) / 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA, molecular weight 294.22) / 4 at a molar ratio of 75 / 25 / 60 / 40 ,4'-diaminodiphenyl ether (DPE, molecular weight 200.24) / p-phenylenediamine (PPD, molecular weight 108.14), formed 20% by weight in DMAC (N,N-dimethylacetamide) and polymerized to give A polyamic acid solution of 3500 poise at 25°C was obtained.

[0160] After adding β-picoline and acetic anhydride to this polyamide solution so that the molar ratio of each relative to the polyamic acid becomes 2.8, it was cast on a stainless steel support at 75°C to obtain a self-supporting polyimide. Amine gel film.

[0161] The gel film was peeled from the support, conveyed through nip rolls, and stretched longitudinally. After longitudinal stretching, both ends of the film were held, and drying was carried out in a tenter while stretching laterally. After drying, it heat-processed using an electric heater, ...

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Abstract

The present invention relates to a polyimide film. The present invention provides a polyimide film having characteristics such as small variations in size and the like. In the polyimide film, both thelinear expansion coefficient [alpha]MD in the transport direction (MD) of the film and the linear expansion coefficient [alpha]TD in the transverse direction (TD) are both 7 ppm / DEG C or less, and the the anisotropy index AI shown by the following equation when measuring the propagation velocity V of the ultrasonic pulse is 15 or less over the entire width. AI=(VMAX^2-VMIN^2) / (VMAX^2+VMIN^2), wherein VMAX^2 represents the square of the maximum value of the pulse propagation velocity, and VMIN^2 represents the square of the minimum value of the pulse propagation velocity.

Description

technical field [0001] The present invention relates to polyimide film and its manufacturing method. Furthermore, it is related with the flexible metal laminated board provided with this polyimide film and metal foil. Background technique [0002] Flexible printed circuit boards (FPC: Flexible printed circuits) are generally manufactured by using a flexible insulating film formed of various insulating materials as a substrate, and bonding metal foil to the surface of the substrate by heating and pressing. . As the insulating film, it is preferable to use a polyimide film excellent in heat resistance and electrical insulation. [0003] In recent years, in order to achieve miniaturization and weight reduction of electronic equipment, miniaturization of wiring provided on a substrate has been advanced, and components that have been miniaturized and increased in density are also mounted on components to be mounted. Therefore, when the dimensional change after the formation of...

Claims

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Application Information

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IPC IPC(8): C08L79/08C08J5/18C08G73/10B32B15/08B32B27/28H05K1/03
CPCH05K1/03C08G73/1071C08J5/18B32B15/08B32B27/281C08J2379/08B32B2457/08H05K2201/0183H05K2201/0154C08L79/08C08G73/1078H05K1/0346
Inventor 小路弘晃我妻亮作大场大史
Owner DUPONT TORAY CO LTD
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