Internal super-thick copper plate laminating method

Abstract

The invention discloses an internal super-thick copper plate laminating method. The internal super-thick copper plate laminating method comprises the following steps of S1, feeding, S2, internal layertreatment, S3, positioning hole drilling, S4, browning, S5, resin printing including printing the surface of an internal layer circuit board processed in the step of S4 with resin which fills and levels up the upper surface and the lower surface of the internal layer circuit board, S6, laminating including laminating the internal layer circuit board oxidized in the step of S5 into a multi-layer substrate to prepare for manufacturing external circuits, and S7, discharging processes. The internal super-thick copper plate laminating method improves poor cutting of filled resin and fiber of internal super-thick copper plates, ensures quality and guarantees high-temperature resistance of automobile sheets.

Description

technical field [0001] The invention relates to the technical field of printed circuit boards, in particular to a lamination method for inner-layer ultra-thick copper plates. Background technique [0002] In order to pursue safety and quick adaptability, thick copper manufacturing process automotive circuit board products are constantly promoting its high performance and diversification. PCBs are used in automobiles, and the environment in which they are used is very harsh. Therefore, compared with PCBs used in other fields, since automotive circuit board products are used in long-term high-temperature environments, the reliability requirements for this type of PCB are more stringent. for strict. [0003] For example, in the prior art, the inner layer core board 6OZ (that is, the inner layer circuit board) is manufactured through multiple etching circuits, and the etched inner layer core board 6OZ will form uneven upper and lower surfaces (as shown in Figure 1(a) As shown ...

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Problems solved by technology

[0003] For example, in the prior art, the inner layer core board 6OZ (that is, the inner layer circuit board) is manufactured through multiple etching circuits, and the etched inner layer core board 6OZ will form uneven upper and lower surfaces (as shown in Figure 1(a) As shown in ), if it is directly laminated with PP and copper foil (as shown in Figure 1(b) for laminated composition), due to the height difference between PP and the inner core board 6OZ, during the lamination process After medium stress, PP is in direct contact with the inner core board 6OZ, and the PP is cut due to the pressure of the raised part on the contact surface between the inner core board 6OZ and PP, and problems such as whitening of the line and air bubbles will occur (as shown in Figure 2 (a) Diagram of the whitening problem of the line, Fig. 2 (b) Schematic diagram of the fiber being cut), even if the high-glue PP is used, the problem is still difficult to solve

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