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Packaging body and manufacturing method thereof

A manufacturing method and package technology, applied in semiconductor/solid-state device manufacturing, electric solid-state devices, semiconductor devices, etc., can solve problems such as shedding, product failure, and difficulty in using implantable device surface protection, and achieve high fatigue resistance , Improve the effect of adhesion

Pending Publication Date: 2018-03-20
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the post-processing packaging method of coating coating has the problem that the coating of the movable part or sensing part is easy to fatigue, wear or fall off, resulting in product failure.
Therefore, the existing post-processing encapsulation method of coating coating is difficult to apply to the surface protection of implantable devices with movable parts

Method used

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  • Packaging body and manufacturing method thereof
  • Packaging body and manufacturing method thereof
  • Packaging body and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0036] Figure 1a to Figure 1d An implantable package according to a first embodiment of the present invention is shown comprising an implantable device 1 and a packaging structure 2 for the implantable device 1 .

[0037] In this embodiment, as Figure 1a to Figure 1d As shown, the implantable device 1 includes a pressure sensor that senses pressure with the concave surface 11S of the silicon cup. In this embodiment, the movable part is also a sensing part), and other parts of the pressure sensor other than the pressure sensing part are immovable parts (non-sensing parts). like Figure 1b As shown, when pressure acts on the silicon cup concave surface (predetermined surface) 11S of the pressure-sensing portion of the pressure sensor, the silicon cup concave surface 11S is deformed, so that the pressure sensor measures the pressure (predetermined parameter) through the deformation of the silicon cup concave surface 11S. ).

[0038] In this embodiment, the encapsulation struc...

no. 2 approach

[0047] like Figure 2a to Figure 2c As shown, the basic structure of the package body 1 according to the second embodiment of the present invention is substantially the same as that of the package body 1 according to the first embodiment of the present invention, and the difference between the two is that the implantable device 1 has a The structure is different.

[0048] Specifically, in this embodiment, the implantable device 1 includes, in addition to the above-mentioned pressure sensor, a signal processing module 14 and a wireless power supply and wireless transmission module 15 connected to the pressure sensor through a lead 13 , and the signal processing module 14 and the wireless power supply and wireless transmission module 15 are all accommodated in the accommodation cavity S of the package structure 2 as the immovable part and the non-sensing part of the implantable device 1 . Since the package components are made of materials such as ceramics or glass, electrostati...

no. 3 approach

[0050] like Figure 3a to Figure 3e As shown, the basic structure of the package body 1 according to the third embodiment of the present invention is substantially the same as the basic structure of the package body 1 according to the second embodiment of the present invention, the difference between the two is that the package structure 2 also includes a flexible The polymer encapsulates the protective layer 24, the base 21 is formed with the guide tube 211 and the structure of the pressure sensor is different.

[0051] Specifically, in this embodiment, after the implantable device 1 is encapsulated by the encapsulation structure 2 , the outer side of the cover plate 22 is further covered with a flexible polymer encapsulation protection layer 24 such as silicone rubber, the flexible polymer encapsulation protection The layer 24 is located on the outside of the encapsulation coating 23 to improve the mechanical compatibility of the entire implantable package 1 .

[0052] Furthe...

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Abstract

The invention relates to the field of packaging, and particularly relates to a packaging body and a manufacturing method thereof. The packaging body comprises a to-be-packaged and protected device, and a packaging structure used for packaging the to-be-packaged and protected device. The to-be-packaged and protected device comprises a non-movable portion and a movable portion or comprises a non-sensing portion and a sensing portion. The packaging structure includes a packaging assembly that at least houses the non-movable portion or the non-sensing portion and a packaging coating that at leastcovers the predetermined surface of the movable portion or the predetermined surface of the sensing portion. The packaging assembly isolates the non-movable portion or the non-sensing portion from thesurrounding environment. The predetermined surface of the movable portion or the predetermined surface of sensing portion is isolated from a medium in the surrounding environment by the packaging coating, while preset parameters on the medium can still be sensed. The packaging body provided by the invention has the characteristics of being capable of protecting and ensuring that various index performances of the to-be-packaged and protected device are not affected at all. Meanwhile, the packaging structure of the packaging body has relatively high fatigue resistance.

Description

technical field [0001] The present invention relates to the field of packaging, more specifically to a packaging body and a manufacturing method thereof. Background technique [0002] In the field of packaging (including the field of industrial packaging and medical packaging, etc.), the packaging structure of the prior art cannot take into account the effective protection of the device that needs packaging protection in the package and at the same time ensure that the various working performances of the device are not affected. problem of impact. The following is based on specific problems in the field of implantable packaging as an example to illustrate the defects of the packaging structure in the prior art. [0003] In recent years, various implantable devices with high precision and good stability have become research hotspots in the field of biomedicine at home and abroad. These implantable devices play an irreplaceable role in the fields of disease diagnosis, disease...

Claims

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Application Information

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IPC IPC(8): H01L23/31H01L21/56
CPCH01L21/56H01L23/31H01L2924/15151H01L2224/48091H01L2224/48137H01L2924/00014
Inventor 杨兴姚嘉林
Owner TSINGHUA UNIV
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