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High-temperature self-repairing conductive adhesive for LED (Light-Emitting Diode) packaging

A technology of LED packaging and conductive glue, which is applied in the field of conductive glue, can solve the problems of low thermal conductivity, few high-power LED chips, and inability to use conductive glue, etc., achieve good conductivity and improve self-healing function

Inactive Publication Date: 2018-03-20
JIANGSU RUIBO PHOTOELECTRIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The thermal conductivity of traditional ordinary conductive adhesives is relatively low, lower than 10W / m·K, and the heat dissipation of high-brightness and high-power LED chips requires its thermal conductivity to be higher than 20W / m·K, so traditional conductive adhesives cannot be used , so it is necessary to develop materials with higher thermal conductivity, such as high thermal conductivity conductive adhesives, and at the same time must be equal to or even better than traditional conductive adhesives in terms of adhesive performance, electrical performance, application performance, and reliability.
There have been some conductive adhesive products in China, but there are not many products that can fully meet the requirements of high-temperature-resistant, high-brightness, and high-power LED chips.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A high-temperature self-healing conductive adhesive for LED packaging, which consists of the following components by weight percentage: 1 part of bismaleimide resin, 8 parts of acrylate, 10 parts of organic titanium modified epoxy resin, p-methoxy 7 parts of isoamyl cinnamate, 1 part of synthetic paraffin resin, 5 parts of polyvinyl butyral, 3 parts of polydimethylsiloxane, 2 parts of barium oxide, 1 part of 1-hydroxycyclohexyl phenyl ketone, 6 parts of isoamyl p-methoxycinnamate, 1 part of reaction diluent, 1.6 parts of curing agent, 0.3 parts of accelerator, and 2.0 parts of coupling agent.

[0016] The reactive diluent is an aliphatic glycidyl ether epoxy resin. The curing agent is one or more of dicyandiamide, modified imidazole and its derivatives, and modified amine curing agents. Accelerators include one or both of 2,4,6-tris(dimethylaminomethyl)phenol and aminoethylpiperazine. The coupling agent includes one or both of γ-glycidyloxypropyltrimethoxysilane and γ...

Embodiment 2

[0018] A high-temperature self-healing conductive adhesive for LED packaging, which consists of the following components by weight percentage: 10 parts of bismaleimide resin, 2 parts of acrylate, 20 parts of organic titanium modified epoxy resin, p-methoxy 2 parts of isoamyl cinnamate, 10 parts of synthetic paraffin resin, 2 parts of polyvinyl butyral, 6 parts of polydimethylsiloxane, 1 part of barium oxide, 5 parts of 1-hydroxycyclohexyl phenyl ketone, 2 parts of isoamyl p-methoxycinnamate, 2 parts of reaction diluent, 0.2 part of curing agent, 2 parts of accelerator, and 0.5 part of coupling agent.

[0019] Reactive diluent, curing agent, promotor, coupling agent are with embodiment 1.

Embodiment 3

[0021] A high-temperature self-healing conductive adhesive for LED packaging, which consists of the following components by weight percentage: 8.4 parts of bismaleimide resin, 5.9 parts of acrylate, 15.3 parts of organic titanium modified epoxy resin, p-methoxy 4.6 parts of isoamyl cinnamate, 5.8 parts of synthetic paraffin resin, 2.9 parts of polyvinyl butyral, 5.2 parts of polydimethylsiloxane, 1.4 parts of barium oxide, 3.3 parts of 1-hydroxycyclohexyl phenyl ketone, 4.1 parts of isoamyl p-methoxycinnamate, 1.6 parts of reaction diluent, 1.2 parts of curing agent, 1.7 parts of accelerator, and 0.8 parts of coupling agent.

[0022] Reactive diluent, curing agent, promotor, coupling agent are with embodiment 1.

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PUM

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Abstract

The invention relates to a high-temperature self-repairing conductive adhesive for LED (Light-Emitting Diode) packaging and belongs to the technical field of conductive adhesives. The conductive adhesive is prepared from the following components in parts by weight: 1 to 10 parts of bismaleimide resin, 2 to 8 parts of acrylate, 10 to 20 parts of organo-titanium modified epoxy resin, 2 to 7 parts ofiso-amyl p-methoxycinnamate, 1 to 10 parts of synthetic paraffin resin, 2 to 5 parts of polyvinyl butyral, 3 to 6 parts of polydimethylsiloxane, 1 to 2 parts of barium oxide, 1 to 5 parts of 1-hydroxycyclohexylphenylketone, 2 to 6 parts of iso-amyl p-methoxycinnamate, 1 to 2 parts of reaction diluent, 0.2 to 1.6 parts of curing agent, 0.3 to 2 parts of accelerant and 0.5 to 2 parts of coupling agent. According to the high-temperature self-repairing conductive adhesive for the LED packaging, disclosed by the invention, by compounding the raw materials, the conductive adhesive has better conductivity and is especially suitable for conductive bonding and packaging of high-end refined electrical and electronic components LED, and the self-repairing function of the conductive adhesive under the condition of high temperature is effectively improved.

Description

technical field [0001] The invention relates to a high-temperature self-repairing conductive adhesive for LED packaging, which belongs to the technical field of conductive adhesives. Background technique [0002] Conductive adhesive, referred to as conductive adhesive, is an adhesive that can effectively bond various materials and has conductive properties. Conductive adhesive can be divided into two categories: structural type and filling type according to its composition. The structural type refers to the conductive adhesive in which the polymer material itself is conductive as the matrix of the conductive adhesive; the filled type refers to the conductive adhesive that usually uses the adhesive as the matrix and relies on the addition of conductive fillers to make the glue conductive. Filled conductive adhesives are widely used at present. The conductive filler added in the filled conductive adhesive is usually metal powder, and silver powder filled conductive adhesive ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/06C09J11/04C09J9/02
CPCC09J4/06C09J9/02C09J11/04C09J11/06
Inventor 刘冬寅
Owner JIANGSU RUIBO PHOTOELECTRIC TECH CO LTD
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