High-temperature self-repairing conductive adhesive for LED (Light-Emitting Diode) packaging
A technology of LED packaging and conductive glue, which is applied in the field of conductive glue, can solve the problems of low thermal conductivity, few high-power LED chips, and inability to use conductive glue, etc., achieve good conductivity and improve self-healing function
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Embodiment 1
[0015] A high-temperature self-healing conductive adhesive for LED packaging, which consists of the following components by weight percentage: 1 part of bismaleimide resin, 8 parts of acrylate, 10 parts of organic titanium modified epoxy resin, p-methoxy 7 parts of isoamyl cinnamate, 1 part of synthetic paraffin resin, 5 parts of polyvinyl butyral, 3 parts of polydimethylsiloxane, 2 parts of barium oxide, 1 part of 1-hydroxycyclohexyl phenyl ketone, 6 parts of isoamyl p-methoxycinnamate, 1 part of reaction diluent, 1.6 parts of curing agent, 0.3 parts of accelerator, and 2.0 parts of coupling agent.
[0016] The reactive diluent is an aliphatic glycidyl ether epoxy resin. The curing agent is one or more of dicyandiamide, modified imidazole and its derivatives, and modified amine curing agents. Accelerators include one or both of 2,4,6-tris(dimethylaminomethyl)phenol and aminoethylpiperazine. The coupling agent includes one or both of γ-glycidyloxypropyltrimethoxysilane and γ...
Embodiment 2
[0018] A high-temperature self-healing conductive adhesive for LED packaging, which consists of the following components by weight percentage: 10 parts of bismaleimide resin, 2 parts of acrylate, 20 parts of organic titanium modified epoxy resin, p-methoxy 2 parts of isoamyl cinnamate, 10 parts of synthetic paraffin resin, 2 parts of polyvinyl butyral, 6 parts of polydimethylsiloxane, 1 part of barium oxide, 5 parts of 1-hydroxycyclohexyl phenyl ketone, 2 parts of isoamyl p-methoxycinnamate, 2 parts of reaction diluent, 0.2 part of curing agent, 2 parts of accelerator, and 0.5 part of coupling agent.
[0019] Reactive diluent, curing agent, promotor, coupling agent are with embodiment 1.
Embodiment 3
[0021] A high-temperature self-healing conductive adhesive for LED packaging, which consists of the following components by weight percentage: 8.4 parts of bismaleimide resin, 5.9 parts of acrylate, 15.3 parts of organic titanium modified epoxy resin, p-methoxy 4.6 parts of isoamyl cinnamate, 5.8 parts of synthetic paraffin resin, 2.9 parts of polyvinyl butyral, 5.2 parts of polydimethylsiloxane, 1.4 parts of barium oxide, 3.3 parts of 1-hydroxycyclohexyl phenyl ketone, 4.1 parts of isoamyl p-methoxycinnamate, 1.6 parts of reaction diluent, 1.2 parts of curing agent, 1.7 parts of accelerator, and 0.8 parts of coupling agent.
[0022] Reactive diluent, curing agent, promotor, coupling agent are with embodiment 1.
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