Liquid absorbing core and supporting column integrated structure flat plate heat pipe based on carbon nano tube array

Abstract

The invention discloses a liquid absorbing core and supporting column integrated structure flat plate heat pipe based on a carbon nano tube array. The liquid absorbing core and supporting column integrated structure flat plate heat pipe based on the carbon nano tube array comprises an upper metal cover plate, a lower metal cover plate and upper and lower metal cover plate liquid absorbing core andsupporting column integrated structures generated on the inner sides of the upper metal cover plate and the lower metal cover plate; the upper metal cover plate and the lower metal cover plate form aclosed cavity by means of edge sealing, and the vacuumized closed cavity is internally filled with work liquid; the upper and lower metal cover plate liquid absorbing core and supporting column integrated structures comprise thin-layer carbon nano tubes growing on the inner surfaces of the metal cover plates and a plurality of vertical carbon nano tubes continuously growing in specific areas of the thin-layer carbon nano tubes, and the thin-layer carbon nano tubes and the vertical carbon nano tubes form flat plate heat pipe capillary cores and flat plate heat pipe supporting columns correspondingly; and the upper and lower metal cover plate supporting columns are arranged in a staggered manner, and the liquid absorbing core and supporting column integrated structure with a staggered arrangement type is formed. The liquid absorbing core and supporting column integrated structure flat plate heat pipe based on the carbon nano tube array has the beneficial effects of being high in heat conductivity, small in size, small in weight and the like, the heat transfer performance of the flat plate heat pipe can be guaranteed, and the mechanical strength safety during heat pipe running can also be achieved.

Description

technical field [0001] The invention relates to a flat heat pipe with an integrated structure of a liquid-absorbing core support column based on a carbon nanotube array, and belongs to the technical field of heat transfer. Background technique [0002] With the gradual development of electronic components in the direction of miniaturization, high power, and high performance, the development process will be accompanied by higher heat flux density, and the heat dissipation problem has gradually become a bottleneck restricting the development of highly integrated electronic components. Due to its high thermal conductivity and good temperature uniformity, the flat heat pipe can quickly transfer and diffuse the electric heat source with high heat flux density, which meets the requirements of electronic equipment for the compactness, reliability, and flexibility of the cooling device, and has gradually become a research solution to high Excellent choice for power device surface he...

AI Technical Summary

Problems solved by technology

[0003] The common flat heat pipe is composed of two metal cover plates. The inner surface of the cover plate is often covered with a capillary core structure such as wire mesh and sintered powder. The thermal conductivity of this capillary core structure is compared with that of the metal cover plate. It is one of the important components of the thermal resistance of the heat pipe, which greatly affects the heat transfer performance of the heat pipe

Moreover, for flat heat pipes, there are still problems such as large liquid flow resistance, large steam channel size, large volume, heavy weight, complicated manufacturing process, and poor sealing.

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