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Non-refrigerated infrared imaging sensor based on super surface and preparation method thereof

An uncooled infrared and imaging sensor technology, used in instruments, scientific instruments, radiation pyrometry, etc., can solve the problems of inability to achieve target band absorption, difficulty in improving process realization, and difficulty in controlling the height of resonant cavity, and achieve the goal of improving detection. The ability to increase the difficulty of the process, the effect of low additional heat capacity

Active Publication Date: 2018-02-27
YANTAI RAYTRON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method greatly increases the process steps and increases the difficulty of process realization, and because the height control of different resonant cavities is very difficult, it is very easy to cause the product to fail to reach the ideal height during the preparation process, and it is also impossible to achieve the absorption of the target band , leading to an increase in the failure rate of the product

Method used

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  • Non-refrigerated infrared imaging sensor based on super surface and preparation method thereof
  • Non-refrigerated infrared imaging sensor based on super surface and preparation method thereof
  • Non-refrigerated infrared imaging sensor based on super surface and preparation method thereof

Examples

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Embodiment 1

[0069] Such as Figure 1-6 As shown, a metasurface-based uncooled infrared imaging sensor includes a double-layer uncooled infrared detector, and the double-layer uncooled infrared detector includes a semiconductor substrate 1 containing a readout circuit and a microbridge support structure The detector body, the detector body includes a first layer of suspended structure and a second layer of suspended structure, the second layer of suspended structure is arranged on the first layer of suspended structure, and the first layer of suspended structure includes a metal reflective layer 2 , an insulating medium layer 3, a metal electrode layer 6, an electrode protection layer 7, a first support layer 5, a heat-sensitive protection layer 9 and a heat-sensitive layer 8, and the second suspended structure includes a metamaterial support layer 11 and is arranged on the The metamaterial support layer 11 and the metamaterial support protection layer 12 are provided with a metamaterial s...

Embodiment 2

[0075] The difference from Implementation 1 is that, as in Figure 7 As shown, the outer contour of the metamaterial structure 13 is rectangular, the center is provided with a rectangular hollow 13-6, the outer contour is provided with a horizontal centerline and a vertical centerline, the rectangular hollow 13-6 and the A thin strip 13-5 that is bent back and forth to form a closed-loop structure is provided between the outer contours. The closed-loop structure formed by the thin strip 13-5 is symmetrical about the horizontal centerline and the vertical centerline respectively. The closed-loop structure The bending part is a right-angle bending, and the material of the thin strip is NiCr, the thickness is 20nm, and the width is 0.5 μm-5 μm.

Embodiment 3

[0077] The difference from Example 1 is that, as Figure 8-Figure 9 As shown, the metamaterial structure 13 includes a rectangular outline formed by a flat strip 13-7, and the center of each side of the rectangular outline is provided with an inward U-shaped bend 13-8, and the flat strip 13- The material of 7 is NiCr, the thickness is 20nm, and the width is 0.5μm-5μm.

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Abstract

The invention relates to a non-refrigerated infrared imaging sensor based on a super surface. The sensor includes a double-layer non-refrigerated infrared detector; the double-layer non-refrigerated infrared detector includes a semiconductor substrate and a detector body; the detector body includes a first-layer suspended structure and a second-layer suspended structure; the first-layer suspendedstructure is composed of a metal reflecting layer, an insulated medium layer, a metal electrode layer, an electrode protection layer, a first supporting layer, a thermosensitive protection layer and athermosensitive layer; the second-layer suspended structure includes a metamaterial supporting layer and a metamaterial supporting protection layer; a metamaterial structure is arranged on the metamaterial supporting protection layer and made of NiCr or / and Al, and the thickness of the metamaterial structure is within a range from 2 nm to 30 nm; the invention also relates to a preparation methodof the sensor; according to the method, the double-layer non-refrigerated infrared detector without carrying out release on a sacrificial layer is provided, and after the metamaterial structure is prepared on the detector, the release on the sacrificial layer is carried out; the preparation process is simple and compatible with a CMOS process, and the functions of multi-color detection, broadbanddetection, narrow-spectrum detection and the like can be achieved.

Description

technical field [0001] The invention relates to an uncooled infrared imaging sensor based on a metasurface and a preparation method thereof, belonging to the field of uncooled infrared detectors. Background technique [0002] Uncooled infrared detectors (uncooled infrared bolometers) have been widely used in civilian fields, such as fire protection, automotive assistance, forest fire prevention, field detection, and environmental protection, in addition to military applications. [0003] Electromagnetic metamaterial (Metamaterial), referred to as metamaterial, refers to a class of artificial composite structures or composite materials with extraordinary electromagnetic properties that natural materials do not have; in 2001, Walser first proposed the concept of electromagnetic metamaterials, using metamaterials can Realize arbitrary "tailoring" of electromagnetic wave and light wave performance, so that special devices such as perfect lens, invisibility cloak, and perfect abs...

Claims

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Application Information

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IPC IPC(8): G01J5/02G01J5/00
CPCG01J5/00G01J5/024G01J2005/0077
Inventor 王宏臣邱栋王鹏陈文礼
Owner YANTAI RAYTRON TECH
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