PCB lamination and fusion anti-wrinkling method

Abstract

The invention relates to a PCB lamination and fusion anti-wrinkling method, which comprises the steps of lamination: laminating and fixing various layers of boards required to be pressed-fit for a PCBonto an operation table of a press machine; fusion frame arrangement: placing a fusion frame on the side of the laminated boards; fusion block arrangement: arranging fusion blocks in a mesh form in aclosed area formed by the fusion frame and the side of the boards; prepreg arrangement: arranging prepregs on the surface of the fusion blocks; copper foil laying: laying a whole piece of copper foilon the surfaces of the boards, fusion frame and the prepregs; press-fit process; and cutting: after the press-fit is completed, cutting the edge of the boards and cutting the fusion frame and the fusion blocks and the prepregs in the fusion frame partially to complete the PCB lamination and fusion. Through the mesh graphic design with a specific effect, the heat loss is reduced, meanwhile, the support area is increased to avoid wrinkling of the copper foil, a large support area cooperates with the prepregs and increases the integration of the fusion zone at the same time, and the fusion graphic frame adopts the copper sheet design to avoid wrinkled extension.

Description

technical field [0001] The invention relates to the field of PCB board processing, in particular to a PCB lamination fusion anti-wrinkle method. Background technique [0002] The PCB board structure is a multi-layer lamination structure. During the lamination of the PCB, the surface copper foil is often made to interfere, and a part is reserved at the edge of the board to avoid phenomena such as expansion, contraction, and displacement of the board. The interference part of the edge of the board is used. The process method of fusion zone has just been produced, but the existing process method of fusion zone is not reasonable enough, which leads to wrinkling of fusion zone after pressing. At the same time, due to the poor bonding force of the fusion area, the layer deviation after lamination is caused, which brings great trouble to the production. Contents of the invention [0003] In order to achieve the above object, the present invention adopts the following technic...

AI Technical Summary

Problems solved by technology

[0002] The PCB board structure is a multi-layer lamination structure. During the lamination of the PCB, the copper foil on the surface is often interfered, and a part is reserved at the edge of the board to avoid the phenomenon of board expansion, shrinkage, displacement, etc., and the edge of the board is used. However, the existing fusion zone process method is not reasonable enough, resulting in wrinkling of the fusion zone after lamination

At the same time, due to the poor bonding force of the fusion area, the layer deviation after lamination is caused, which brings great trouble to the production