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Microcoaxial ultrawide band coupling device

A coupler and ultra-broadband technology, which is applied in the field of micro-coaxial ultra-broadband couplers, can solve the problems of large energy coupling and radiation loss, standing wave difference, and limited application frequency, and achieve wide bandwidth, reliable performance, and small size Effect

Active Publication Date: 2018-02-13
CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the interconnection of microwave signals, the energy coupling and radiation loss are large, the standing wave is poor in signal interconnection, and the application frequency is limited
Therefore, it is difficult to further realize the integration and miniaturization of the RF / microwave system with the feeding technology of the planar process, and it is also difficult to make better use of the performance of the existing ultra-wideband devices

Method used

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  • Microcoaxial ultrawide band coupling device
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  • Microcoaxial ultrawide band coupling device

Examples

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Embodiment Construction

[0026] The embodiments of the present invention are described in detail below. This embodiment is implemented on the premise of the technical solution of the present invention, and detailed implementation methods and specific operating procedures are provided, but the protection scope of the present invention is not limited to the following implementation example.

[0027] Such as Figure 1-10 As shown, this embodiment is based on the micro-nano processing technology of metal sputtering and ultraviolet lithography, and the micro-coaxial inner conductor is used to directly interconnect the integrated chip with microwave signals, and the outer conductor 5 is directly grounded. The specific design content includes the following three parts:

[0028] (1) Design of micro-coaxial inner conductor

[0029] The micro-coaxial coupler is composed of a grounded outer conductor 5 and an inner conductor 6 that transmits signals. The structural size of the inner conductor 6 and the design ...

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Abstract

The invention discloses a microcoaxial ultrawide band coupling device, which comprises an outer conductor of an H-shaped metal cavity structure, an H-shaped inner conductor and a photoresist support body, wherein the inner conductor grows in the outer conductor; the photoresist support body is arranged between the bottom of the inner conductor and the bottom of the outer conductor; a first supportsection and a third support section are positioned on the same straight line; a second support section and a fourth support section are positioned on the same straight line; a gap with the graduallyincreased width is formed between the first conductor and the second conductor; the first conductor is in horizontal arrangement; the second conductor is in inclined arrangement along the first conductor; a plurality of through holes are formed in the upper surface of the outer conductor; the through holes are positioned in the gap of the first conductor and the second conductor. The invention provides a high-performance signal interconnection coupling structure with the advantages of smaller size, reliable performance and wider bandwidth. High integration degree and high performance of a microwave and millimeter wave system are realized; the microwave and millimeter wave coupling circuit with a plurality of octaves in the micro dimension structure is realized.

Description

technical field [0001] The invention relates to a microwave circuit technology, in particular to a micro-coaxial ultra-broadband coupler. Background technique [0002] In recent years, the development of radio frequency microsystems (RF Microsystems) has greatly promoted the multi-function and miniaturization of radio frequency / microwave systems, and at the same time put forward higher requirements for the integration of antennas and circuits, and the requirements for radio frequency / microwave transmission lines and feeders Greater bandwidth, lower loss and smaller size. However, in the existing microwave integrated circuits, planar semi-open structures based on planar printed circuit board (PCB) technology, such as microstrip, coplanar waveguide and stripline, etc., are mostly used. In the interconnection of microwave signals, the energy coupling and radiation loss are large, the standing wave is poor in signal interconnection, and the application frequency is limited. Th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P5/20
CPCH01P5/20
Inventor 马强周杨王波李佩
Owner CHINA ELECTRONIC TECH GRP CORP NO 38 RES INST
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