Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Chip type tantalum capacitor

A tantalum capacitor and chip technology, applied in the field of chip tantalum capacitors, can solve the problem that the capacitor cannot meet the high temperature working environment, and achieve the effect of easy welding and high temperature resistance.

Inactive Publication Date: 2018-02-13
铜陵百墩实业有限公司
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the deficiencies of the prior art, the present invention provides a chip tantalum capacitor, which overcomes the deficiencies of the prior art, and has a reasonable design and a compact structure. By adding a nickel strip between the anode tantalum core and the bonding silver paste, the nickel With the release of the temperature stress generated by the tantalum core, the high temperature resistance of the capacitor is improved, and the problem that the existing capacitor cannot meet the high temperature working environment is solved. The anode tantalum wire of the core block is welded with a new lead wire, which is easy to be welded.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip type tantalum capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0018] A chip-type tantalum capacitor, including a ceramic dielectric diaphragm 1, a plurality of ceramic dielectric diaphragms 1 are sequentially stacked and dislocated to form a tantalum chip, the tantalum chip is wrapped with a layer of bonding conductive adhesive 2, and then bonded with conductive adhesive Wrapped with a metal shell 3, the low...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a chip type tantalum capacitor. The chip type tantalum capacitor comprises a plurality of ceramic medium diaphragms, wherein the plurality of ceramic medium diaphragms are sequentially stacked and staggered to form a tantalum chip; a layer of adhering conductive glue is coated to the exterior of the tantalum chip; a metal outer casing is coated to the exterior of the adhering conductive glue; a nickel tape is arranged at the lower end of the tantalum chip, fixedly welded on the tantalum chip, adhered into the metal outer casing by adhering silver paste, and communicatedwith a cathode leading-out end which is fixedly arranged on the metal outer casing. The chip type tantalum capacitor has the advantages that by additionally arranging the nickel tape between an anodetantalum core and the adhering silver paste, the nickel tape is used for releasing the temperature stress produced by the tantalum core, so that the high temperature-resistant ability of the capacitoris improved, and the problem of failure to meet the high-temperature working environment in the existing capacitor is solved; a new leading-out metal wire is led out and welded from an anode tantalumwire of a core block, so that the fusion welding is facilitated.

Description

technical field [0001] The invention relates to the technical field of capacitors, in particular to a chip tantalum capacitor. Background technique [0002] Tantalum electrolytic capacitors mainly play the electrical functions of energy storage, filtering, bypass, coupling, decoupling, and transfer in electronic circuits. They are an indispensable part of electronic circuits. In industries such as drilling, geological exploration, space exploration, and space vehicles, the ambient temperature of the equipment far exceeds 125°C. The existing tantalum electrolytic capacitors can no longer meet the requirements for the use of electronic equipment in the above fields. Although ceramic capacitors and glass glaze capacitors Such as inorganic capacitors can be used in high temperature environments above 125°C, but the capacitance of these capacitors is too small to replace the role of tantalum electrolytic capacitors in the circuit, and they are easily affected by moisture or corro...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01G9/00H01G9/008
CPCH01G9/0003H01G9/008
Inventor 李文功
Owner 铜陵百墩实业有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products