Flat film-type cooling device

Abstract

The invention discloses a flat film-type cooling device, which comprises an upper metal cooling layer, a lower metal cooling layer and a resin layer, wherein the upper metal cooling layer is a flat body and the thickness is 0.01-0.20mm; the lower metal cooling layer is a flat body, the thickness is 0.01-0.20mm, and the lower metal cooling layer corresponds to the upper metal cooling layer; the resin layer is located between the upper metal cooling layer and the lower metal cooling layer and is arranged into a film micro-pipe with a heat pipe pattern; an upper film surface and a lower film surface of the film micro-pipe are combined with the lower surface of the upper metal cooling layer and the upper surface of the lower metal cooling layer separately; and a cooling fluid can be stored into the film micro-pipe to form the flat film-type cooling device formed by compounding the micro-pipe and cooling fins.

Description

technical field [0001] The invention relates to a flat-film heat dissipation device, which is composed of micro heat pipes and heat sinks, and specifically realizes the design of a heat dissipation device combining thin micro heat pipes and heat sinks with high efficiency, active and passive combination. Background technique [0002] Mobile electronic devices tend to be thinner and multitasking, and due to the increase in the density and frequency of electronic components, local overheating will occur after a long period of use. This phenomenon not only brings consumers a bad experience of overheating and tactility In other words, the chip of a mobile electronic device is usually the main heat source when it is working. The heat dissipation is not only to reduce the temperature of the chip itself to ensure that it can work normally within the required temperature range, but also to prevent local overheating of the shell during heat dissipation. To cause bad user experience f...

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Problems solved by technology

[0010] The main technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art, and provide a flat film type heat sink, which is compositely formed with a micro heat pipe and a heat sink, to solve the deformation and problems of the thin micro heat pipe in the prior art. The problem of uneven heat dissipation has the function of improving the stability of the molding and strengthening the uniformity of heat dissipation; it is formed by composite molding of micro heat pipes and heat sinks to solve the problem of uniform heat dissipation of thin micro heat pipes and heat sinks in the prior art, and has the function of The reliability of the mobile electronic device can be maintained; it is compositely molded with a micro heat pipe and a heat sink to solve the problem of the different facets of the heat pipe type and the plane area of ​​the heat sink in the prior art, thereby reducing the temperature in the cavity of the mobile electronic device thermal disorder, and effectively remove heat to the outside of the cavity of the mobile electronic device; it is compositely formed with micro heat pipes and heat sinks to solve the problems of manufacturing cost and assembly time of thin micro heat pipes and heat sinks in the prior art, and thus has the advantages of Improve the efficiency of manufacturing convenience and assembly yield

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