Wide spectrum response photoelectric detector and preparation method thereof
A photodetector and wide-spectrum technology, which is applied in the field of wide-spectrum response photodetector and its preparation, can solve the problems of weak light absorption ability and narrow spectral response range, and achieve high responsivity and detectability, and low dark current density , The effect of reducing the leakage current
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Embodiment 1
[0042] See figure 1 , figure 1 This is a flow chart of a preparation method of a broad-spectrum response photodetector provided by an embodiment of the present invention, wherein the preparation method includes:
[0043] (a) Select sapphire substrate;
[0044] (b) Making a bottom electrode on the surface of the sapphire substrate;
[0045] (c) fabricating a light absorption layer on the surface of the bottom electrode;
[0046] (d) Fabricating a top electrode on the surface of the light absorption layer to complete the preparation of the broad-spectrum response photodetector.
[0047] Preferably, step (b) may include:
[0048] (b1) Using a magnetron sputtering process to grow a first metal material on the surface of the sapphire substrate;
[0049] (b2) In an atmosphere of nitrogen and argon, using a rapid thermal annealing process to form an ohmic contact between the sapphire substrate and the first metal material to complete the preparation of the bottom electrode.
[0050] Wherein, in s...
Embodiment 2
[0075] Please refer to Figure 2a-Figure 2f , Figure 2a-Figure 2f It is a schematic diagram of a preparation method of a broad-spectrum response photodetector according to an embodiment of the present invention. The preparation method includes the following steps:
[0076] Step 1. Select the sapphire substrate 201, such as Figure 2a Shown.
[0077] Step 2: Use magnetron sputtering process to sputter Ti material on the surface of sapphire substrate 201; under nitrogen and argon atmosphere, use rapid thermal annealing process to make sapphire substrate 201 and Ti material form ohmic contact to complete The bottom electrode 202 is prepared as Figure 2b Shown.
[0078] Step 3: Using magnetron sputtering process, grow Ga on the surface of bottom electrode 202 2 O 3 , As the first light absorbing layer 203 such as Figure 2c Shown.
[0079] The fourth step is to prepare a spin-coated precursor solution; spin-coat the precursor solution onto the surface of the first light absorbing layer ...
Embodiment 3
[0084] Please refer to image 3 , image 3 This is a schematic structural diagram of a broad-spectrum response photodetector provided by an embodiment of the present invention. The photodetector uses the above as Figure 2a-Figure 2f The preparation method shown is made. Specifically, the photodetector includes: a sapphire substrate 301, a bottom electrode 302, and Ga 2 O 3 Light absorption layer 303, hybrid perovskite light absorption layer 304, β-Ga 2 O 3 The light absorbing layer 305 and the top electrode 306.
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