Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Heat dissipation circuit board and method for fabricating same

A technology of circuit boards and heat sinks, which is applied in the direction of multilayer circuit manufacturing, printed circuit components, printed circuits connected with non-printed electrical components, etc., can solve the problems of ceramic heat sinks, circuit boards falling off, and high cost. Achieve the effects of good voltage resistance, good thermal stability, and good binding ability

Pending Publication Date: 2018-01-23
许明杰
View PDF1 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although this heat dissipation circuit board has good heat dissipation performance, it has the following defects: metal heat dissipation parts will significantly reduce the withstand voltage performance of the circuit board; It is difficult to effectively combine with the circuit board, and it is easy to fall off the circuit board after a small number of cold and heat cycles, resulting in poor thermal stability

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] figure 1 It is a structural schematic diagram of Embodiment 1 of a heat dissipation circuit board. Such as figure 1 As shown, the heat dissipation circuit board includes a substrate 10 and a radiator 20 disposed in the substrate 10 and passing through the substrate 10, wherein:

[0053] The substrate 10 includes a first insulating base material 111, a second insulating base material 121, and a cured insulating layer 13 connecting the first insulating base material 111 and the second insulating base material 121. The cured insulating layer 13 is also in contact with the side surface of the radiator 20. bonding. Wherein, the surface of the first insulating substrate 111 far away from the cured insulating layer 13 (the upper surface of the substrate 10 ) has a first metal layer 112 , and the first metal layer 112 is formed as a first conductive pad 113 and a negative pad 114 . pattern layer. The surface of the second insulating base material 121 away from the cured ins...

Embodiment 2

[0068] Figure 8 It is a structural schematic diagram of Embodiment 2 of a heat dissipation circuit board. combine Figure 4 with Figure 8 As shown, the heat dissipation circuit board includes a substrate 100, and a radiator 20 disposed in the substrate 100 and passing through the substrate 100, wherein:

[0069] The substrate 100 includes a first insulating base material 1101, a second insulating base material 1201, and a cured insulating layer 130 connecting the first insulating base material 1101 and the second insulating base material 1201. The cured insulating layer 130 is also in contact with the side surface of the radiator 20. bonding. Wherein, the surface of the first insulating substrate 1101 away from the cured insulating layer 130 (the upper surface of the substrate 100 ) has a first metal layer 1102 . The surface of the second insulating substrate 1201 away from the cured insulating layer 130 (the lower surface of the substrate 100 ) has a second metal layer ...

Embodiment 3

[0083] Figure 14 It is a structural schematic diagram of Embodiment 3 of a heat dissipation circuit board. Such as Figure 14 As shown, the difference between embodiment 3 and embodiment 2 is:

[0084] The first metal layer 1102 , the third metal layer 231 and the fifth metal layer 1401 are etched, so as to form a first conductive pattern layer including positive pads 1501 and negative pads 1502 on the upper surface of the circuit board. Wherein, a part of the positive pad 1501 is formed on the upper surface of the substrate 100, and another part is formed on the upper surface of the radiator 20; similarly, a part of the negative pad 1502 is formed on the upper surface of the substrate 100, and the other part is formed on the radiator 20. 20 on the upper surface.

[0085] The heat dissipation circuit board in Embodiment 3 is especially suitable for mounting flip-chip semiconductor heat generating devices. Figure 15 It is a structural schematic diagram of an embodiment of...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention provides a heat dissipation circuit board and a method for fabricating the same. In an embodiment, the heat dissipation circuit board comprises a substrate and a heat dissipation body, wherein the substrate is provided with a first metal layer and a second metal layer, the first metal layer is formed on an upper surface of the substrate, the second metal layer is formed on a lower surface of the substrate, the first metal layer forms a conductive pattern layer, the heat dissipation body is arranged in the substrate and penetrates through the substrate, the heat dissipation body comprises a metal body, a first heat conduction insulation layer, a third metal layer, a second heat conduction insulation layer and a fourth metal layer, the first heat conduction insulation layer isformed on the upper surface of the metal body, the third metal layer is formed on the first heat conduction insulation layer, the second heat conduction insulation layer is formed on a lower surface of the metal body, the fourth metal layer is formed on the second heat conduction insulation layer, outer surfaces of the first metal layer and the third metal layer are flush with each other, and outer surfaces of the second metal layer and the fourth metal layer are flush with each other. The heat dissipation circuit board has favorable voltage resistance and heat dissipation performance, and islow in cost and excellent in thermal reliability.

Description

technical field [0001] The invention relates to a heat dissipation circuit board and a method for preparing the heat dissipation circuit board; in particular, the invention relates to a heat dissipation circuit board embedded with a heat dissipation body and a preparation method thereof. Background technique [0002] Semiconductor devices such as LEDs (Light Emitting Diodes), Thyristors, GTOs (Gate Turn Off Thyristors), MOSFETs (Power Field Effect Transistors), GTRs (Power Transistors), IGBTs (Insulated Gate Bipolar Transistors) and Power Diodes, etc. During the working process, a relatively large amount of heat is usually released. In order to ensure its working performance and service life, the circuit board carrying this type of semiconductor device is required to have good heat dissipation performance. [0003] US patent application US 20090301765A1 discloses a printed circuit board, the circuit board has at least one through hole, a heat dissipation element is arranged ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/18H05K3/46
Inventor 许明杰
Owner 许明杰
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com