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High-temperature-resistant distributed buffer insulation sheet and notebook computer

A distributed, high-temperature-resistant technology, applied in insulation improvement, electrical digital data processing, film/sheet release coating, etc., can solve the problem of functional need to be further expanded, achieve good insulation, improve product quality, overall structure simple effect

Pending Publication Date: 2022-05-27
SUZHOU YIBANG ELECTRONICS MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The parts of the notebook computer are not only various but also compactly arranged, and there will be a certain connection relationship between them. At present, a large number of insulating sheets are used in the notebook computer to meet the insulation requirements, but the existing insulating sheets are compatible with the notebook computer parts. There is still a lot of room for improvement, and its functionality needs to be further expanded

Method used

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  • High-temperature-resistant distributed buffer insulation sheet and notebook computer
  • High-temperature-resistant distributed buffer insulation sheet and notebook computer
  • High-temperature-resistant distributed buffer insulation sheet and notebook computer

Examples

Experimental program
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Effect test

Embodiment 1

[0028] like Figure 1-3 As shown, a high temperature resistant distributed buffer insulating sheet includes a release film 1, a foam double-sided adhesive group 2, a PC film 3 and a PI tape 4, which are arranged in order from bottom to top and are matched. The opposite sides of the group 2 are sticky, one side of the foam double-sided adhesive tape group 2 is bonded to the PC film 3 by adhesiveness, and the opposite side of the foam double-sided adhesive tape group 2 is bonded to the release film 1 by adhesiveness. The cotton double-sided tape group 2 includes several foam double-sided tapes with different structures (different shapes, thicknesses, hardnesses, sizes, etc.) At the position, the PC film 3 is non-adhesive, a number of gaps with different structures (including shapes, sizes, etc.) are opened on the PC film 3, the PI tape 4 has a T-shaped structure and several step structures are arranged on it, and the PI tape 4 faces the PC film. One side of 3 is sticky, the sid...

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Abstract

The invention discloses a high-temperature-resistant distributed buffer insulation sheet and a notebook computer, the high-temperature-resistant distributed buffer insulation sheet comprises a release film, a foam double-faced adhesive tape group, a PC film and a PI adhesive tape, the foam double-faced adhesive tape group comprises a plurality of foam double-faced adhesive tapes adhered to different positions of the PC film, the PC film is provided with a plurality of notches with different structures, and the PI adhesive tape is connected with the release film. And one surface, facing the PC film, of the PI adhesive tape is sticky. The hollowed-out notches are formed in the PC film, on one hand, the sticky face, not covered by the PC film, of the PI adhesive tape can be exposed, the bonding effect is achieved, on the other hand, the insulation sheet can be helped to be bonded to a part, with steps, of a notebook computer, attaching is neat, bubbles do not exist, the foam double-faced adhesive tape set can be attached to different positions of the PC film, and the bonding effect is good. The composite material has the multiple effects of good insulation, buffering, high temperature resistance, voltage resistance, flame retardance, high surface glossiness, uniform visual effect and the like, and is suitable for being popularized and used in the fields of notebook computers and the like.

Description

technical field [0001] The invention belongs to the technical field of electronic equipment insulation, and in particular relates to a high temperature resistant distributed buffer insulation sheet and a notebook computer. Background technique [0002] With the improvement of the national economic level and the popularization of notebook computers, people's demand for notebook computers is also increasingly diversified. In addition to the beautiful appearance, it is also necessary to meet people's aesthetic requirements for the internal configuration. The parts of the notebook computer are not only various but also compactly arranged, and there will be a certain connection between them. At present, a large number of insulating sheets are used in the notebook computer to meet the insulation requirements, but the existing insulating sheets are suitable for the notebook computer parts. There is still a lot of room for improvement, and its functionality needs to be further expa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/29C09J7/30C09J7/40C09J7/50C09J133/00G06F1/16
CPCC09J7/29C09J7/30C09J7/40C09J7/50C09J133/00G06F1/1656C09J2301/124C09J2469/006Y02B80/10
Inventor 陈佩君
Owner SUZHOU YIBANG ELECTRONICS MATERIAL CO LTD
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