FR-4 ceramic PCB support plate manufacturing method

A production method, FR-4 technology, applied in printed circuit manufacturing, circuit board tool positioning, electrical components, etc., can solve problems such as board dropping and jamming, and achieve the effect of reducing scrap rate and eliminating scrap

Inactive Publication Date: 2017-12-15
长沙牧泰莱电路技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] Based on this, it is necessary to provide a processing method suitable for fixing the ceramic substrate to solve the problems that the ceramic substrate will be jammed and dropped when it passes through the horizontal line of the conventional circuit board.

Method used

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  • FR-4 ceramic PCB support plate manufacturing method

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Embodiment Construction

[0015] Since the PCB factory will produce a large amount of scrap during the production process, choosing a suitable size scrap to make the carrier board can effectively use idle resources, and FR-4 material is easy to process, the rigidity meets the demand, and the smooth surface will not cause damage to the ceramic plate. Scratching, stable chemical properties and other characteristics, it is quite suitable as a carrier for ceramic substrates. In order to conform to the description habit, in this article, the PCB sluggish material refers to the edge material / sheet material / plate / substrate, and the four refer to the same in this method.

[0016] A method for manufacturing a ceramic PCB carrier board made of FR-4 material, using FR-4 PCB sluggish material as a base material, and adopting the form of a gong-through groove and a controlled deep groove, so that the ceramic substrate can be fixed in the groove and leak out of the board The inner effective area ensures that the hor...

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Abstract

The invention discloses an FR-4 ceramic PCB support plate manufacturing method. Inactive PCB boundary materials are used, a grinded through groove plus a controlled deep groove is adopted, a ceramic board can be fixed in the groove, an effective area in the board can be leaked, horizontal line liquid medicine is ensured to be thoroughly reacted with the board surface, scrap caused by board falling or board clamping on the horizontal line are eliminated, the scrap rate is greatly reduced, and a PCB enterprise does not need to arrange the horizontal line independently for the ceramic substrate.

Description

technical field [0001] The invention relates to the technical field of ceramic PCB production, in particular to a ceramic PCB carrier board. Background technique [0002] Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of an alumina (AL2Q3) or aluminum nitride (ALN) ceramic substrate at high temperature, on one or both sides. The produced ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength, and can etch various patterns like a PCB board, and has a large current-carrying capacity. ability. Therefore, ceramic substrates have become the basic materials for high-power power electronic circuit structure technology and interconnection technology. However, due to the small size and thin thickness of the ceramic substrate, when the ceramic substrate passes through the horizontal line of the conventional circuit board, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00
CPCH05K3/0008H05K3/0044
Inventor 黄孟良王金刚
Owner 长沙牧泰莱电路技术有限公司
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