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High hardness, high thermal conductivity and low expansion coefficient Al-Cu-CNT material and preparation method thereof

A technology with low expansion coefficient and high thermal conductivity, applied in the field of materials, can solve the problems of poor overall performance of Al-Cu materials, and achieve the effects of excellent economy, easy realization and simple operation

Inactive Publication Date: 2017-12-05
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problem that the overall performance of the existing Al-Cu material is not high, the present invention invents an Al-Cu-CNT material with high hardness, high thermal conductivity and low expansion coefficient, and also provides a "mechanical alloying-powder pressing-sintering- "Heat treatment" method for preparing high-hardness Al-Cu materials, by adding CNTs, to prepare an Al-Cu-CNT material with better comprehensive performance, high hardness, high thermal conductivity and low expansion coefficient

Method used

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  • High hardness, high thermal conductivity and low expansion coefficient Al-Cu-CNT material and preparation method thereof
  • High hardness, high thermal conductivity and low expansion coefficient Al-Cu-CNT material and preparation method thereof
  • High hardness, high thermal conductivity and low expansion coefficient Al-Cu-CNT material and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] Such as figure 1 , 3 , 5 shown.

[0035] A kind of preparation method of Al-4Cu material:

[0036] First, prepare 40 g of Al and Cu single substance mixed powder, including 96wt.% (38.4 g) of Al powder and 4wt.% (1.6 g) of Cu powder, put the mixed powder in a beaker and stir evenly, and place it in a drying box Dry at 100°C for 1 hour;

[0037] Secondly, first weigh 160 g of agate balls and place them in a 500 ml nylon ball mill jar according to the ball-to-material ratio of 4:1, then place the dried and uniformly mixed powder in the nylon ball mill jar, and seal it with a cover;

[0038] Then, install the ball mill jar on the planetary ball mill, start the ball mill, set the ball mill parameters to 250 r / min, stop the ball mill for 60 minutes and stop for 10 minutes, and take out the powder in the ball mill jar after grinding for 24 hours;

[0039] Afterwards, the obtained powder is packed into a mold with a diameter of 30mm, and pressed on a 100t four-column hydra...

Embodiment 2

[0044] Such as figure 2 , 4 , 6 shown.

[0045] A kind of preparation method of Al-4Cu-0.5CNT material:

[0046] This example is similar to Example 1, except that CNT is added, including Al powder 95.5wt.% (38.2 g), Cu powder 4wt.% (1.6 g), and CNT 0.5wt.% (0.2 g);

[0047] figure 1 It is the morphology diagram of Al-4Cu-0.5CNT after ball milling. It can be seen that CNT is mechanically alloyed with Al and Cu, which can significantly reduce the thermal expansion coefficient of the material and further improve the thermal conductivity of the material; Figure 4 and Figure 6They are the topography and EDS analysis before and after heat treatment, respectively. From the SEM-EDS analysis, the composition of the material is consistent with the preset concept, which can effectively guarantee the performance of the material; Table 1 has Al-4Cu-0.5 The hardness value of the CNT material was analyzed and found that the addition of CNT did not reduce the hardness of the material,...

Embodiment 3

[0051] A preparation method of Al-2.8Cu-0.7CNT material:

[0052] First, prepare 40 g of mixed powder of Al, Cu and CNT, including 96.5wt.% (38.6 g) of Al powder, 2.8wt.% (1.12 g) of Cu powder, and 0.7wt.% (0.28 g) of CNT. Stir in a beaker evenly, and dry in a drying oven at 120°C for 1.5 hours;

[0053] Secondly, first weigh 120 g of agate balls and place them in a 500 ml nylon ball mill jar according to the ball-to-material ratio of 3:1, then place the dried and uniformly mixed powder in the nylon ball mill jar, and seal it with a cover;

[0054] Then, install the ball milling tank on the planetary ball mill, start the ball milling, set the ball milling parameters to 200 r / min, stop the ball milling for 60 minutes for 15 minutes, and take out the powder in the ball milling tank after 24 hours of ball milling;

[0055] Afterwards, the obtained powder is packed into a mold with a diameter of 25mm, and pressed on a 100t four-column hydraulic press to obtain a round block with ...

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Abstract

A high hardness, high thermal conductivity and low expansion coefficient Al-Cu-CNT material and a preparation method thereof are disclosed, the high hardness, high thermal conductivity and low expansion coefficient Al-Cu-CNT material is characterized in that: the high hardness, high thermal conductivity and low expansion coefficient Al-Cu-CNT material is prepared from Al powder, Cu powder and CNT; the preparation method is as follows: first, the Al powder, the Cu powder and the CNT are uniformly mixed and dried for high-energy ball milling for mechanical alloying, ball-milled powder is pressed into blocks, a graphite-powder-coated sample is sintered for further fully mechanical alloying, and finally solution and aging treatment of the sintered sample is performed. The Al-Cu-CNT material has the advantages of uniform composition, high hardness, greatly-improved elastic modulus and thermal conductivity, low thermal expansion coefficient, and wide application prospect in the field of electronic packaging.

Description

technical field [0001] The invention relates to a material technology, especially an Al-Cu material and a preparation method thereof, specifically an Al-Cu-CNT material with high hardness, high thermal conductivity and low expansion coefficient and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics technology, electronic components should have higher integration, faster operation speed and larger capacity, which makes the complexity and density of components in electronic devices and electronic devices increasingly This will inevitably lead to an increase in the heat generation of the circuit, an increase in operating temperature, and a decrease in stability. As an important part of the circuit, electronic packaging plays the role of circuit support, sealing, internal and external point connection, heat dissipation and shielding, and has an important impact on the performance and reliability of the circuit. [0003] Al...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/12C22C1/05C22F1/057B22F9/04
CPCC22C21/12B22F9/04B22F2009/041B22F2009/043B22F2998/10C22C1/05C22C26/00C22C2026/002C22F1/057B22F3/02B22F3/10B22F2003/248
Inventor 许晓静王浩朱宸煜杨松杜东辉刘志刚王亚
Owner JIANGSU UNIV
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