Copper alloy sheet for heat-dissipating component, and heat-dissipating component

Abstract

Provided is a copper alloy sheet for a heat-dissipating component that has high strength, excellent bending workability and heat-dissipating properties. The copper alloy sheet contains 0.1-1.0 mass % of Ni, 0.01-0.3 mass % of Fe and 0.03-0.2 mass % of P, with the remainder comprising Cu and unavoidable impurities. In a direction parallel to the rolling direction, the tensile strength is 580 MPa or higher, the proof stress is 560 MPa or higher, and the elongation is 6% or higher. In a direction perpendicular to the rolling direction, the tensile strength is 600 MPa or higher, the proof stress is 580 MPa or higher, and the elongation is 3% or higher. When the electrical conductivity is 50% IACS or higher, the ratio between the bending radius R and the sheet thickness t (R / t) is set to be 0.5, and the sheet is bent at an angle of 90-degree with the direction of the bend line being a direction perpendicular to the rolling direction, the bending limit width is 70 mm or more, and when the sheet is subjected to close-contact bending with the direction of the bend line being a direction perpendicular to the rolling direction, the bending limit width is 20 mm or more.

Description

technical field [0001] The invention relates to a copper alloy plate for a heat dissipation element and a heat dissipation element. Background technique [0002] Electronic devices such as personal computers, tablet terminals, smartphones, mobile phones, digital cameras, and digital video cameras use cooling elements to dissipate heat generated from electronic components such as the mounted CPU, liquid crystal, and imaging elements. The heat dissipation element is used to prevent the temperature of the electronic component from rising excessively, prevent the thermal runaway of the electronic component and enable it to function normally. As the heat dissipation element, raw materials such as pure copper with high thermal conductivity, stainless steel with excellent strength and corrosion resistance, or lightweight aluminum alloy can be used and processed. These heat dissipation elements not only undertake the heat dissipation function, but also undertake the role of resisti...

AI Technical Summary

Problems solved by technology

[0005] As the raw material of the heat dissipation element, although pure copper has excellent thermal conductivity, its strength is low, and the heat dissipation element cannot be thinned

Stainless steel has a low thermal conductivity (2-3% IACS), so it cannot be used as a cooling element for electronic components with a large heat dissipation

Aluminum alloys have insufficient strength and thermal conductivity

On the other hand, although many copper alloys are excellent in strength and electrical conductivity (for example, refer to Patent Documents 1 to 3), wide bending cannot be performed.

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