Photosensitive liquid resin
A technology of liquid resin and epoxy resin, which is applied in the fields of optics, optomechanical equipment, instruments, etc., can solve the problems of high price, achieve high manufacturing precision, improve curing forming precision, and good photosensitivity
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0015] Embodiment 1: This photosensitive liquid resin comprises the raw material of following parts by weight: 85 parts of novolac epoxy resins, 10 parts of double-ended acrylate-based polysiloxanes, 5 parts of polyacrylate-based polysiloxanes, acrylate polysiloxanes 10 parts of siloxane, 1 part of 1-hydroxycyclohexyl acetophenone.
[0016] After being formed by UV curing, its volume shrinkage rate=0.9%, warpage factor CF(6)=0.01, CF(11)=0.03.
Embodiment 2
[0017] Embodiment 2: This photosensitive liquid resin comprises the raw material of following weight portion: 85 parts of bisphenol A type epoxy resins, 85 parts of two-end acrylate-based polysiloxanes, 50 parts of polyepoxy polysiloxanes, polyepoxy polysiloxanes 20 parts of acrylate-based polysiloxane, 60 parts of acrylate, 6 parts of benzoin dimethyl ether;
[0018] After being formed by UV curing, the volume shrinkage rate is <0.8%, the warpage factor CF(6) <0.01, and the CF(11) <0.03.
Embodiment 3
[0019] Embodiment 3: This photosensitive liquid resin comprises the raw material of following weight portion: 85 parts of cycloaliphatic epoxy resins, 85 parts of double-end acrylate-based polysiloxanes, 50 parts of polyepoxy polysiloxanes, oxa Cyclobutane compound 50 parts, polyacrylate polysiloxane 20 parts, triethylene glycol divinyl ether 30 parts, 4-hydroxybutyl vinyl ether 30 parts, benzophenone 3 parts, 4-p-toluene 3 parts of mercaptobenzophenone.
[0020] After being formed by UV curing, the volume shrinkage rate is <0.8%, the warpage factor CF(6)<0.01, and the CF(11)<0.03.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com