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Packaging adhesive for infrared LED chip, preparation method and application thereof

A technology of LED chips and encapsulation glue, applied in the field of material chemistry, can solve the problems of fast decay rate, poor moisture and heat resistance, high cost of silica gel, and achieve the effect of high reliability and high reliability

Active Publication Date: 2017-11-17
广州惠利电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Most of the conventional infrared LEDs use silica gel, but silica gel has high cost, poor adhesion, and poor heat and humidity resistance.
[0003] Although epoxy resin has the advantages of low price and good adhesion, when the general epoxy resin system is applied to infrared LEDs, the light attenuation is large and the attenuation rate is relatively fast.
[0004] Moreover, some products used for infrared LED packaging on the market have the defects of poor reflow soldering resistance and poor adhesion performance.

Method used

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  • Packaging adhesive for infrared LED chip, preparation method and application thereof
  • Packaging adhesive for infrared LED chip, preparation method and application thereof
  • Packaging adhesive for infrared LED chip, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] An encapsulant for infrared LED chips, consisting of component A and component B,

[0053] The A component is prepared from the following raw materials:

[0054] epoxy resin

[0055] Bisphenol A epoxy resin 95g

[0056] Active diluent

[0057] Benzyl glycidyl ether 4g

[0058] Auxiliary

[0059] Defoamer (silicone modified polymer defoamer, model: BYK-SP) 0.5g

[0060] Leveling agent (silicon polyether copolymer, model: SLE-7350) 0.5g

[0061] The B component is mainly prepared from the following raw materials:

[0062] Anhydride

[0063] Methyl hexahydrophthalic anhydride 30g

[0064] Hexahydrophthalic anhydride 40g

[0065] Methyl Nadic Anhydride 5g

[0066] modifier

[0067] Silicone resin, model: SC-B22 15g

[0068] Accelerator

[0069] Tetrabutylammonium bromide 2g

[0070] antioxidant

[0071] Triphenyl phosphite 2g

[0072] UV absorber

[0073] 2-(2′-Hydroxy-5′-methylphenyl)benzotriazole 1g

[0074] solvent

[0075] Glycerol 5g

[0076] The mass...

Embodiment 2

[0082] An encapsulant for infrared LED chips, consisting of component A and component B,

[0083] The A component is prepared from the following raw materials:

[0084] epoxy resin

[0085] Bisphenol A Glycidyl Ether 90g

[0086] Active diluent

[0087] C12~14 Alkyl Glycidyl Ether 10g

[0088] Auxiliary

[0089] Defoamer (silicone modified polymer defoamer, model: BYK-072) 0.5g

[0090] Leveling agent (silicon polyether copolymer, model: SLE-7350) 0.5g

[0091] The B component is mainly prepared from the following raw materials:

[0092] Anhydride

[0093] Methyl hexahydrophthalic anhydride 30g

[0094] Hexahydrophthalic anhydride 45g

[0095] Pyromellitic anhydride 5.5g

[0096] modifier

[0097] Silicone resin, model: SC-B22 10g

[0098] Accelerator

[0099] Triphenylbutylphosphine bromide 1.5g

[0100] antioxidant

[0101] Trioctyl phosphite 2g

[0102] UV absorber

[0103] 2,4-Dihydroxybenzophenone 1g

[0104] solvent

[0105] Cyclohexanol 5g

[0106] T...

Embodiment 3

[0112] An encapsulant for infrared LED chips, consisting of component A and component B,

[0113] The A component is prepared from the following raw materials:

[0114] epoxy resin

[0115] Bisphenol F type glycidyl ether 88g

[0116] 3,4-Epoxycyclohexylcarboxylate 7g

[0117] Active diluent

[0118] Propylene oxide phenyl glycidyl ether 4g

[0119] Auxiliary

[0120] Defoamer (silicone modified polymer defoamer, model: BYK-072) 0.5g

[0121] Leveling agent (silicon polyether copolymer, model: SLE-7350) 0.5g

[0122] The B component is mainly prepared from the following raw materials:

[0123] Anhydride

[0124] Methylhexahydrophthalic anhydride 30.5g

[0125] Hexahydrophthalic anhydride 45g

[0126] modifier

[0127] Silicone resin, model: SC-B22 15g

[0128] Accelerator

[0129] Triphenylmethylphosphine bromide 1.5g

[0130] antioxidant

[0131] Trioctyl phosphite 3g

[0132] UV absorber

[0133] 2,4-Dihydroxybenzophenone 1g

[0134] solvent

[0135] Methy...

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Abstract

Belonging to the technical field of material chemistry, the invention relates to a packaging adhesive for an infrared LED chip, a preparation method and application thereof. The packaging adhesive is composed of a component A and a component B, the component A is prepared from the following raw materials: epoxy resin, an active diluent and an assistant, and the component B is prepared from the following raw materials: acid anhydride, a modifier, an accelerant, an antioxidant, an ultraviolet absorbent, and a solvent. The packaging adhesive for an infrared LED chip can reach the effects of lowering the luminous decay of infrared LED and the decay rate, and can be widely applied in packaging of infrared LED chips.

Description

technical field [0001] The invention relates to the technical field of material chemistry, in particular to a packaging glue for infrared LED chips and a preparation method and application thereof. Background technique [0002] At present, the application of infrared LEDs in the market has gradually expanded from the fields of security, sensors, and remote controls to plant lights and other fields. The demand is increasing, and there are high requirements for light decay and light intensity. Most conventional infrared LEDs use silica gel, but silica gel has high cost, poor adhesion, and poor heat and humidity resistance. [0003] Although epoxy resin has the advantages of low price and good adhesion, when the general epoxy resin system is applied to infrared LEDs, the light attenuation is relatively large and the attenuation rate is relatively fast. [0004] Moreover, some products used for infrared LED packaging on the market have the defects of poor reflow soldering resis...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C08G59/42H01L33/56
CPCC08G59/42C08G59/4215C08G59/4223C08L2205/025C09J163/00H01L33/56C08L63/00
Inventor 张云柱庄小媚郑长利
Owner 广州惠利电子材料有限公司
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