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Thermal superconducting heat dissipation component and manufacturing method thereof

A technology for a heat dissipation component and a manufacturing method, which is applied in the field of heat transfer, can solve the problem that an aluminum heat sink cannot meet the heat dissipation requirements of a high heat flux density and a high power module, and achieves the effects of being suitable for mass production, reducing production costs, and high strength

Inactive Publication Date: 2017-09-26
SHANGHAI JIAXI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the shortcomings of the prior art described above, the purpose of the present invention is to provide a thermal superconducting heat dissipation assembly and its manufacturing method, which is used to solve the problem that the aluminum heat sink in the prior art cannot meet the heat dissipation requirements of high heat flux density and high power modules. demand problem

Method used

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  • Thermal superconducting heat dissipation component and manufacturing method thereof
  • Thermal superconducting heat dissipation component and manufacturing method thereof
  • Thermal superconducting heat dissipation component and manufacturing method thereof

Examples

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Embodiment 1

[0080] see Figure 1 to Figure 11 , the present invention provides a thermal superconducting heat dissipation assembly, the thermal superconducting heat dissipation assembly includes: a thermal superconducting heat dissipation plate 1, a thermal superconducting circuit 13 is formed in the thermal superconducting heat dissipation plate 1, and the thermal superconducting conduit The road 13 is a closed pipeline, and the thermal superconducting pipeline 13 is filled with a heat transfer working medium (not shown); a heat dissipation fin plate structure 2, and the heat dissipation fin plate structure 2 is located on the thermal superconducting heat dissipation plate 1; the heat dissipation fin plate structure 2 includes at least one heat dissipation fin 21 extending in a wave shape along a direction parallel to the surface of the thermal superconducting heat dissipation plate 1; specifically, the heat dissipation fin 21 can be It extends in a wave shape along the length direction ...

Embodiment 2

[0097] see Figure 12 and Figure 13 , this embodiment also provides a thermal superconducting heat dissipation assembly, the structure of the thermal superconducting assembly described in this embodiment is roughly the same as that of the thermal superconducting heat dissipation assembly described in Embodiment 1, the difference between the two is : In Embodiment 1, the heat dissipation fin plate structure 2 includes a first heat dissipation fin plate 22, and the first heat dissipation fin plate 22 is composed of one heat dissipation fin 21; and in the present embodiment, the heat dissipation fin plate The heat dissipation fin plate structure 2 includes a second heat dissipation fin plate 23, and the second heat dissipation fin plate 23 includes a plurality of heat dissipation fins 21 and connecting parts 231 located at both ends of the heat dissipation fins 21; The heat dissipation fins 21 are arranged in parallel and at intervals, and the connecting portion 231 is integral...

Embodiment 3

[0101] This embodiment also provides a thermal superconducting heat dissipation assembly. The structure of the thermal superconducting assembly described in this embodiment is roughly the same as that of the thermal superconducting heat dissipation assembly described in Embodiment 1. The difference between the two lies in: In Embodiment 1, the heat dissipation fin plate structure 2 includes a first heat dissipation fin plate 22, and the first heat dissipation fin plate 22 is located on a surface of the thermal superconducting heat dissipation plate 1; while in this embodiment The heat dissipation fin plate structure 2 includes two first heat dissipation fin plates 22 , and the two first heat dissipation fin plates 22 are respectively located on two opposite surfaces of the thermal superconducting heat dissipation plate 1 .

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Abstract

The invention provides a thermal superconducting heat dissipation component and a manufacturing method thereof. The thermal superconducting heat dissipation component comprises a thermal superconducting heat dissipation plate and a heat dissipation fin plate structure, wherein a thermal superconducting pipeline is a closed pipeline, is formed in the thermal superconducting heat dissipation plate and is filled with a heat transfer working medium; the heat dissipation fin plate structure is positioned on at least one surface of the thermal superconducting heat dissipation plate; the heat dissipation fin plate structure comprises at least one heat dissipation fin plate extending in a wavy shape in the direction parallel to the surface of the thermal superconducting heat dissipation plate. The heat dissipation fin plate structure comprising at least one heat dissipation fin plate extending in a wavy shape in the direction parallel to the surface of the thermal superconducting heat dissipation plate is formed on the surface of the thermal superconducting heat dissipation plate, so that the heat dissipation area can be greatly increased, the heat dissipation capability is multiplied, the volume is reduced, the weight is reduced, and the bearing strength and the anti-deformation capacity of the thermal superconducting heat dissipation component can also be increased.

Description

technical field [0001] The invention belongs to the technical field of heat transfer, and in particular relates to a thermal superconducting heat dissipation component and a manufacturing method thereof. Background technique [0002] With the rapid development of power electronics technology, the requirements for modularization, integration, lightweight, low cost and high reliability are getting higher and higher. Therefore, in solar inverters, uninterruptible power supplies (UPS), charging piles, power MosFET (metal oxide semiconductor field effect transistor), Diode (diode), IGBT ( Insulated Gate Bipolar Transistors) and other power devices. As the integration of these power components is getting higher and higher, the power density is also increasing, and the heat generated by themselves is also increasing during work, and the heat flux density is getting higher and higher. The conduction and dissipation of heat will cause the temperature of the chip in the power device...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L23/367H01L21/48F28D15/02F28F3/08
CPCF28D15/02F28D15/0283F28D2021/0029F28F3/086F28F2215/08F28F2275/06H01L21/4803H01L23/3672H01L23/427
Inventor 仝爱星斯奕超曾巧
Owner SHANGHAI JIAXI TECH CO LTD
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