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Optical fingerprint sensing packaging structure

A packaging structure, optical technology, applied in the direction of acquiring/arranging fingerprints/palmprints, character and pattern recognition, instruments, etc., can solve the problems of complex structural design, large volume of optical mechanism, reduction, etc., to achieve volume reduction and thin thickness , space-saving effect

Inactive Publication Date: 2017-09-19
CHIPMOS TECH INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the larger size of the aforementioned optical mechanism or the more complex structural design, it is difficult to effectively reduce the overall size of the optical fingerprint sensing device

Method used

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  • Optical fingerprint sensing packaging structure
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  • Optical fingerprint sensing packaging structure

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Embodiment Construction

[0050] figure 1 is a schematic cross-sectional view of the optical fingerprint sensing package structure of the first embodiment of the present invention. Please refer to figure 1 , in this embodiment, the optical fingerprint sensing package structure 100 includes a circuit carrier 110 , an optical element 120 , a fingerprint sensing chip 130 and a packaging compound 140 . The circuit carrier 110 can be a rigid circuit board or a flexible circuit board, which includes a dielectric layer 111 , a first patterned circuit layer 112 and a second patterned circuit layer 113 . The first patterned wiring layer 112 and the second patterned wiring layer 113 are respectively located on opposite sides of the dielectric layer 111, and can selectively pass through the multilayer metal layers or conductive vias (plated) disposed in the dielectric layer 111. through hole / via) electrical connection. The optical element 120 is disposed above the circuit carrier 110 and is electrically connec...

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Abstract

The invention provides an optical fingerprint sensing packaging structure. The optical fingerprint sensing packaging structure includes a line carrier board, an optical component, a fingerprint sensing chip and packing glue. The optical component is electrically connected to the line carrier board; a gap is formed between the optical component and the line carrier board; and the optical component has a light-transmitting region. The fingerprint sensing chip is arranged in the gap, and is corresponding to the light-transmitting region of the optical component. The fingerprint sensing chip is electrically connected to the optical components. The packaging glue is arranged on the line carrier board, covers the optical component and the fingerprint sensing chip, and is exposed out of a light-output surface of the optical component. The size of the optical fingerprint sensing packaging structure is greatly reduced, the thickness is thin, and a micromation design demand can be met.

Description

technical field [0001] The invention relates to a fingerprint sensing packaging structure, in particular to an optical fingerprint sensing packaging structure. Background technique [0002] With the continuous improvement of modern people's requirements for the security of personal data, the security mode unlocked by entering a default password is not only easy to be cracked, but also difficult to meet the needs of users. Therefore, the security mode of unlocking through biometric technology is gradually flourishing. Fingerprint identification technology is currently the most widely used biometric identification technology. Its principle is to first retrieve the user's fingerprint information, and then use the identification software to compare the user's fingerprint characteristics to determine the identity of the fingerprint owner. [0003] Common fingerprint sensing devices can be roughly divided into optical fingerprint sensing devices and capacitive fingerprint sensing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K9/00
CPCG06V40/1318
Inventor 潘玉堂周世文
Owner CHIPMOS TECH INC
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