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High-flame-retardancy high-strength high-transparence polyimide film and preparation method thereof

A polyimide film, high-strength technology, applied in chemical instruments and methods, organic chemistry, compounds of elements of Group 5/15 of the periodic table, etc., can solve the problems of high processing difficulty, high expansion coefficient, poor transparency, etc. , to achieve the effect of improving mechanical properties and heat resistance, strong cross-linking and rigidity enhancement

Active Publication Date: 2017-09-08
HUBEI DINGLONG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Although polyimide has excellent comprehensive performance, traditional PI has some disadvantages, such as high processing difficulty, poor strength, poor transparency, weak flexibility, high expansion coefficient, high cost, etc.

Method used

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  • High-flame-retardancy high-strength high-transparence polyimide film and preparation method thereof
  • High-flame-retardancy high-strength high-transparence polyimide film and preparation method thereof
  • High-flame-retardancy high-strength high-transparence polyimide film and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] 1) Clean all the glass instruments to be used in the experiment and dry them for later use. Add 0.0121g (0.125mmol) 4-aminophenyl-3,5 -Diethyl-4-aminophenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphorylethane (ADADOPPE) and 1.0980g (4.875mmol) 2-(4- Aminophenyl)-5-aminobenzoxazole (AAPBO), then add 10.3g N,N-dimethylacetamide (DMAc) solvent, stir at room temperature until ADADOPPE and AAPBO are all dissolved; The temperature is maintained at 20°C;

[0032] 2) After the dissolution is completed, quickly add 1.4711g (5mmol) 2,3'3,4'-biphenyltetracarboxylic dianhydride (α-BPDA) into the three-necked flask, and the total solid content is 20% (the total solid content is m ADADOPPE+AAPBO+BPADA / m ADADOPPE+AAPBO+BPADA+DMAc ); after the addition, react at 20°C for 12h to obtain light yellow polyamic acid glue;

[0033] 3) Apply the prepared polyamic acid glue solution evenly on a clean glass plate through a film applicator, and then place the glass plate in an oven...

Embodiment 2

[0035] 1) Clean all the glass instruments used in the experiment and dry them for later use. Add 0.0243g (0.25mmol) 4-aminophenyl-3,5 -Diethyl-4-aminophenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphorylethane (ADADOPPE) and 1.0699g (4.75mmol) 2-(4- Aminophenyl)-5-aminobenzoxazole (AAPBO), then add 10.3g N,N-dimethylacetamide (DMAc) solvent, stir at room temperature until ADADOPPE and AAPBO are all dissolved; The temperature is maintained at 20°C;

[0036] 2) After the dissolution is completed, quickly add 1.4711g (5mmol) 2,3'3,4'-biphenyltetracarboxylic dianhydride (α-BPDA) into the three-necked flask, and the total solid content is 20% (the total solid content is m ADADOPPE+AAPBO+BPADA / m ADADOPPE+AAPBO+BPADA+DMAc ); after the addition, react at 20°C for 12h to obtain light yellow polyamic acid glue;

[0037] 3) Apply the prepared polyamic acid glue solution evenly on a clean glass plate through a film applicator, and then place the glass plate in an oven to bake t...

Embodiment 3

[0039] 1) Clean all the glass instruments used in the experiment and dry them for later use. Add 0.0362g (0.375mmol) 4-aminophenyl-3,5 -Diethyl-4-aminophenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphorylethane (ADADOPPE) and 1.0417g (4.625mmol) 2-(4- Aminophenyl)-5-aminobenzoxazole (AAPBO), then add 14.8g N, N-dimethylacetamide (DMAc) solvent, stir at room temperature until ADADOPPE and AAPBO are all dissolved; The temperature is maintained at 20°C;

[0040] 2) After the dissolution is completed, quickly add 1.4711g (5mmol) 2,3'3,4'-biphenyltetracarboxylic dianhydride (α-BPDA) into the three-necked flask, and the total solid content is 20% (the total solid content is m ADADOPPE+AAPBO+BPADA / m ADADOPPE+AAPBO+BPADA+DMAc ); after the addition, react at 20°C for 12h to obtain light yellow polyamic acid glue;

[0041] 3) Apply the prepared polyamic acid glue solution evenly on a clean glass plate through a film applicator, and then place the glass plate in an oven to b...

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Abstract

The invention discloses a high-flame-retardancy high-strength high-transparence polyimide film and a preparation method thereof. The preparation method comprises the following steps: 1) dissolving 4-amino phenyl-3,5-diethyl-4-amino phenyl-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-phosphoryl ethane and 2-(4-amino phenyl)-5-amino benzoxazole into a polar solvent, and stirring till the components are completely dissolved so as to obtain a mixed solution; 2) adding 2,3'3,4-biphenyltetracarboxylic dianhydride into the mixed solution, and keeping the temperature of a reaction system so as to obtain a polyamide acid adhesive after the reaction is completed; 3) uniformly coating a plate mold with the polyamide acid adhesive, performing programmed heating thermal imidization, after the heating program is completed, cooling to the room temperature, and demolding, so as to obtain the high-flame-retardancy high-strength high-transparence polyimide film. Due to introduction of a phosphorus element, the flame retardancy and the transparence of the high-flame-retardancy high-strength high-transparence polyimide film disclosed by the invention are improved; due to introduction of a benzoxazole heteroaromatic structure in a main chain, the bond energy of a primary bond is improved, and furthermore the mechanical properties and the thermal resistance can be improved.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a highly flame-retardant, high-strength, high-transparency polyimide film and a preparation method thereof. Background technique [0002] As high-temperature insulating materials have become indispensable materials in the field of electronic products, polyimide (PI) has become an increasingly important commodity due to its light weight, flexibility, and ultra-thin properties. Since the advent of polyimide, the world's demand for it has grown at an annual rate of almost 6.5%, ranging from photovoltaic energy, semiconductor packaging, liquid crystal displays, to military industry, automobiles, aviation and other fields, and the lightweight and miniaturization of electronic products. Let polyimide occupy an increasingly important position. PI has developed into one of the most widely used heat-resistant aromatic heterocyclic materials. [0003] Although polyimide has exc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08C07F9/6574
CPCC07F9/657172C08G73/1007C08G73/1085C08J5/18C08J2379/08
Inventor 胡思前汪聪茜陈薇陈妤红刘继延尤庆亮
Owner HUBEI DINGLONG CO LTD
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