Preparation method of low AGEs wafer biscuits
A technology for wafers and biscuits, which is applied in the field of preparation of low-AGEs wafers, can solve the problems affecting the nutrition, health care and safety of wafers, and large amount of production, so as to improve food safety and nutrition and reduce sugar. Formation of end-products, flavor-refreshing effects
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Examples
Embodiment 1
[0021] 1) Take 100g of flour with 26% gluten, 2g of starch, 0.4g of ammonium bicarbonate, 0.1g of sodium bicarbonate, 150g of water with a water temperature of 14°C, and 0.03g of catechin, mix well, beat for 8±2min, and filter the slurry , to remove insoluble substances;
[0022] 2) Pour the slurry filtered in step 1) into an aperture disc-type wafer baking mold and bake for 8±1min to obtain wafer slices;
[0023] The upper mold temperature of the burning mold is 140°C, and the lower mold temperature is 145°C;
[0024] 3) Select the qualified pie slices; ensure product quality.
[0025] 4) Take 0.03g of salt, 30g of white shortening, 30g of white sugar powder, 0.2g of essence, 0.8g of palm oil, and 0.01g of catechin, mix well, and make stuffing;
[0026] 5) Add the stuffing prepared in step 4) to the cake slices selected in step 3) by using a lamination machine to obtain wafer cakes;
[0027] 6) Send the wafer pieces obtained in step 5) to a tablet press for processing, and...
Embodiment 2
[0030] Embodiment 2, with embodiment 1, the difference is,
[0031] 1) Take 150g of flour with 26% gluten, 8g of starch, 0.8g of ammonium bicarbonate, 0.3g of sodium bicarbonate, 200g of water with a water temperature of 14°C, and 0.1g of catechin, mix well, beat for 8±2min, and filter the slurry , to remove insoluble substances;
[0032] 2) Pour the slurry filtered in step 1) into an aperture disc-type wafer baking mold and bake for 8±1min to obtain wafer slices;
[0033] The upper mold temperature of the burning mold is 145°C, and the lower mold temperature is 150°C;
[0034] 4) Take 0.07g of table salt, 40g of white shortening, 40g of white sugar powder, 0.4g of essence, 1.2g of palm oil, and 0.05g of catechin, mix well, and make stuffing.
[0035] The content of AGEs in wafer biscuits was 0.39μg / kg.
Embodiment 3
[0036] Embodiment 3, with embodiment 2, the difference is,
[0037] 1) Take 130g of flour with 26% gluten, 5g of starch, 0.6g of ammonium bicarbonate, 0.2g of sodium bicarbonate, 160g of water with a water temperature of 14°C, and 0.2g of catechin, mix well, beat for 8±2min, and filter the slurry , to remove insoluble substances;
[0038] 2) Pour the slurry filtered in step 1) into an aperture disc-type wafer baking mold and bake for 8±1min to obtain wafer slices;
[0039] The upper mold temperature of the burning mold is 145°C, and the lower mold temperature is 150°C;
[0040] 4) Take 0.05g of salt, 35g of white shortening, 35g of white sugar powder, 0.3g of essence, 1.0g of palm oil, and 0.03g of catechin, mix well, and make stuffing.
[0041] The content of AGEs in wafer biscuits was 0.43μg / kg.
[0042] In order to confirm the inhibitory effect of adding catechin on the content of AGEs in wafer biscuits, the applicant has done three experiments of comparative examples, a...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com