Epoxy resin composition good in transparency and application thereof to field of cars

A technology of epoxy resin and transparency, applied in the direction of epoxy resin glue, adhesive type, adhesive additive, etc., can solve the problems of loss, extraction, decline of polymer mechanical properties, etc.

Active Publication Date: 2017-08-25
上海都昱新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the colorless, transparent and fast-curing epoxy resin adhesive produced in China has poor weather resistance and light and heat stability, and yellowing and whitening are common.
[0006] In addition, light stabilizers also have the following disadvantages: (1) poor compatibility with polymers, and cannot be uniformly disperse

Method used

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  • Epoxy resin composition good in transparency and application thereof to field of cars

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preparation example Construction

[0037] The preparation method of described organic clay modified epoxy resin is as follows:

[0038] (1) Add organoclay and N,N-dimethylacetamide into the reactor, heat up to 70°C, stir for 3 hours, add epoxy resin, keep warm at 70°C for 10 hours, add 70°C deionized water, Extract part of N,N-dimethylacetamide; the weight ratio of the organic clay to the N,N-dimethylacetamide is 1:3; the weight ratio of the organic clay to the epoxy resin for (0.05-0.2): 1;

[0039] (2) Debubble the extracted mixture in vacuum at 80°C for 6 hours, add glutaric anhydride and octadecyltrimethylammonium chloride, continue to remove bubbles in vacuum at 80°C for 2 hours, and then solidify at 80°C for 2 hours under normal pressure. Curing at 100°C for 1h and curing at 120°C for 5h to obtain the organoclay-modified epoxy resin; the weight ratio of the organoclay to the glutaric anhydride and the octadecyltrimethylammonium chloride is 1: (0.2-0.5): (0.1-0.3).

[0040] The preparation method of des...

Embodiment 1

[0099] The epoxy resin composition with good transparency includes the following components in parts by weight: 50 parts of bisphenol A epoxy resin; 25 parts of organic clay modified epoxy resin; 1 part of light stabilizer; 1 part of curing agent; 20 parts of curing agent; 6 parts of thinner; 25 parts of filler; 1 part of coupling agent; 1.5 parts of thixotropic agent;

[0100] Wherein, the organoclay described in the organoclay modified epoxy resin is a composite composition of 2,4,6-trihydroxybenzoic acid grafted with sodium dodecylsulfonate and acrylic attapulgite; the curing The agent is a polythiol curing agent and a modified amine curing agent; the light stabilizer is a composite polymer light stabilizer, and the composite polymer light stabilizer is grafted 2-phenylbenzimidazole-5 -Sulfonic acid and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone polyvinyl chloride with fumaric acid 2,2,6,6-tetramethylpiperidinol polyethylene glycol Alcohol monomethyl ether diester copolymer...

Embodiment 2

[0125] The epoxy resin composition with good transparency includes the following components in parts by weight: 45 parts of bisphenol A epoxy resin; 30 parts of organic clay modified epoxy resin; 1 part of light stabilizer; 1 part of curing agent; 20 parts of curing agent; 6 parts of thinner; 25 parts of filler; 1 part of coupling agent; 1.5 parts of thixotropic agent;

[0126] Wherein, the organoclay described in the organoclay modified epoxy resin is a composite composition of 2,4,6-trihydroxybenzoic acid grafted with sodium dodecylsulfonate and acrylic attapulgite; the curing The agent is a polythiol curing agent and a modified amine curing agent; the light stabilizer is a composite polymer light stabilizer, and the composite polymer light stabilizer is grafted 2-phenylbenzimidazole-5 -Sulfonic acid and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone polyvinyl chloride with fumaric acid 2,2,6,6-tetramethylpiperidinol polyethylene glycol Alcohol monomethyl ether diester copolymer...

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Abstract

The invention provides an epoxy resin composition good in transparency. The epoxy resin composition is prepared from the following components in parts by weight: 30 to 70 parts of bisphenol A epoxy resin, 10 to 35 parts of organic clay modified epoxy resin, 0.1 to 2 parts of light stabilizer, 0.1 to 2 parts of antioxidant, 10 to 25 parts of curing agent, 0.1 to 15 parts of diluting agent, 20 to 40 parts of filling matrial, 0.5 to 1.5 parts of coupling agent and 0.5 to 3 parts of thixotropic agent, wherein organic clay in the organic clay modified epoxy resin is a compound composition of sodium dodecyl sulfate grafted 2,4,6-trihydroxybenzoic acid and acrylic attapulgite clay; the curing agent comprises a polymercaptan curing agent and a modified amine curing agent; the light stabilizer is a compound macromolecular light stabilizer; the compound macromolecular light stabilizer is a copolymer of 2-phenylbenzimidazole-5-sulfonic acid and 2,2'-dihydroxy-4,4'-dimethoxybenzophenone grafted polyvinyl chloride and fumaric acid 2,2,6,6-tetramethylpipradrol polyethylene glycol monomethyl ether diester.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to an epoxy resin composition with good transparency and its application in the automotive field. Background technique [0002] Epoxy resin refers to a thermosetting polymer that contains two or more epoxy groups, has an organic compound such as aliphatic, alicyclic or aromatic, and can form a bulky network structure through the reaction of epoxy groups. polymer. The cured epoxy resin has good physical and chemical properties. It has excellent bonding strength to the surface of metal and non-metal materials, good dielectric properties, small shrinkage rate, good dimensional stability and high hardness. Good flexibility, stable to alkali and most solvents. [0003] Epoxy resin adhesives are widely used and have excellent bonding ability to a variety of materials. They have the advantages of high bonding strength, excellent electrical properties, low shrinkage, stable dimensions, ...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04C09J11/06C09J11/08
CPCC08K2003/265C08L2201/10C08L2205/025C08L2205/035C09J11/04C09J11/06C09J11/08C09J163/00C08L63/00C08L27/06C08K13/06C08K9/04C08K3/346C08K3/26C08K3/36C08K5/42C08K5/132
Inventor 杨丽燕吴平章
Owner 上海都昱新材料科技有限公司
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