Method for optimizing the manufacturing technique of single-sided aluminum substrate

Abstract

The invention relates to the technical field of circuit board manufacturing and in particular to a method for optimizing the manufacturing technique of a single-sided aluminum substrate. The method comprises following steps of: cutting: cutting the single-sided aluminum substrate into a prescribed dimension in accordance with a production requirement of the single-sided aluminum substrate; baking: stacking the aluminum substrates together and baking the aluminum substrates for 3 to 5 hours at the temperature from 140 to 148 degrees centigrade, wherein the thickness of each stack is 40 to 48 cm; C, laser drilling: processing holes on the aluminum substrates by using laser drilling technology; D, line production: subjecting the aluminum substrates to film pasting, exposure, development and etching; E, solder resist: protecting the line not required to be soldered and preventing the entry of tin from causing short circuit; F, V cutting: cutting the surface of the aluminum substrate by using a V cutting machine to form a semi-V groove; G, punching: processing the outline of the aluminum substrate by using a punch press to form holes and a specified shape; H, line test: detecting whether the completed lines operate normally; and I, surface OSP: forming an organic solderability preservative on the aluminum substrate by using reactive resin.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to a method for optimizing the production process of a single-sided aluminum substrate. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of a three-layer structure, which is a circuit layer (copper foil), an insulating layer and a metal base layer. For high-end use, it is also designed as a double-sided board, and the structure is a circuit layer, an insulating layer, an aluminum base, an insulating layer, and a circuit layer. Very few applications are multilayer boards, which can be made by laminating ordinary multilayer boards with insulating layers and aluminum substrates. [0003] Aluminum substrate, commonly used in LED lighting products. There are two sides, the white side is for soldering the LED pins, and the other side shows t...

AI Technical Summary

Problems solved by technology

[0007] Aiming at the problems of high defective product rate and high production cost caused by the practical drilling and milling machines in the existing aluminum substrate production process, the present invention proposes a method for optimizing the production process of single-sided aluminum substrate. When using a punching machine instead of a milling machine for punching and punching the shape, it not only improves the production efficiency of the product, but also reduces the defective rate of the product

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