Fabrication method for plating copper in through hole of printed circuit board with high thickness-diameter ratio

Abstract

The invention discloses a fabrication method for plating copper in a through hole of a printed circuit board with a high thickness-diameter ratio. The fabrication method comprises the following steps of firstly, performing first full-board electroplating on a production board by a DC electroplating mode, plating bottom copper and flattening the through hole, wherein the production board is a board piece subjected to copper deposition; secondly, performing second full-board electroplating by a pulse electroplating mode, and increasing the thickness of hole copper; thirdly, fabricating an outer-layer circuit pattern, opening a window in the through hole, performing first pattern electroplating by a pulse electroplating mode, and further increasing the thickness of hole copper; and finally, performing second pattern electroplating by the DC electroplating mode, electroplating and flattening a pulse copper plated layer, and increasing the thickness of the hole copper until the thickness requirement of the hole copper is reached. Combination of conventional DC electroplating and pulse electroplating is employed during the fabrication process of plating copper in the through hole of the circuit board, the copper plating time of the through hole is effectively shortened, the production efficiency of the circuit board is improved, and the rejection rate and the cost are reduced.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for manufacturing through-hole copper plating of a high-thickness-to-diameter ratio printed circuit board. Background technique [0002] In the method of copper plating through-holes of printed circuit boards with a board thickness ≥ 8mm and a thickness-to-diameter ratio of 20:1 or more, ordinary DC electroplating and pulse electroplating are usually used to plate copper through holes; ordinary DC electroplating: use small The long-time method of current is used for deep-hole copper plating, and the copper is thickened to the required thickness; pulse electroplating: it is an electroplating method that periodically turns on and off the electroplating circuit, or superimposes a certain waveform pulse on a fixed DC, Thicken copper to required thickness. [0003] Ordinary DC electroplating will have the following defects: (1) The deep plating abili...

AI Technical Summary

Problems solved by technology

[0005] The present invention aims at the problems of high scrap rate, low production efficiency and high production cost by using ordinary direct current electroplating or pulse electroplating alone in the manufacturing method of the existing high thickness-to-diameter ratio printed circuit board, and provides a high-thickness-to-diameter ratio printed circuit board. A manufacturing method for through-hole copper plating of a circuit board, which can shorten the copper plating time of the through-hole, improve the production efficiency of the circuit board, reduce the scrap rate and reduce the copper plating cost of board surface waste