High-temperature curing high-temperature-resistant impregnating adhesive and preparation method thereof

A high-temperature curing and high-temperature-resistant technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problems of poor wetting effect of impregnating glue, decreased colloid performance, short service life, etc., to achieve strong colloid Performance, strong adhesion, and the effect of improving the service life

Inactive Publication Date: 2017-07-07
CARBON COMPOSITESTIANJIN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Aiming at the various deficiencies in the performance of the impregnating glue during construction in the existing domestic high-temperature environment, the present invention provides a high-temperature curing high-temperature resistant impregnating glue and its preparation method to solve the problem of poor wetting effect of the impregnating glue when used in a high-temperature environment and poor colloidal properties. Severe drop, weak adhesion, short service life and other problems

Method used

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  • High-temperature curing high-temperature-resistant impregnating adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Preparation of component A: 100 parts by weight of bisphenol A epoxy resin, 0.5 part of silane coupling agent, and 1 part of thixotropic agent were mixed and stirred evenly.

[0025] Preparation of component B: 100 parts of liquid modified aromatic amine curing agent.

[0026] Mix and stir components A and B in a weight ratio of 4:1 to obtain a high-temperature curing high-temperature resistant impregnating glue.

Embodiment 2

[0028] Preparation of component A: 100 parts by weight of bisphenol A epoxy resin, 1 part of silane coupling agent, and 1 part of thixotropic agent were mixed and stirred evenly.

[0029] Preparation of component B: 100 parts of liquid modified aromatic amine curing agent.

[0030] Mix and stir components A and B in a weight ratio of 4:1 to obtain a high-temperature curing high-temperature resistant impregnating glue.

Embodiment 3

[0032] Preparation of component A: 100 parts by weight of bisphenol A epoxy resin, 2 parts of silane coupling agent, and 2 parts of thixotropic agent were mixed and stirred evenly.

[0033] Preparation of component B: 100 parts of liquid modified aromatic amine curing agent.

[0034] Mix and stir components A and B in a weight ratio of 4:1 to obtain a high-temperature curing high-temperature resistant impregnating glue.

[0035] The dipping glue prepared in the three embodiments of the present invention is tested for performance according to the relevant requirements of GB 50728-2011, and the test data is shown in Attached Table 1

[0036] Table I

[0037]

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PUM

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Abstract

The invention provides a high-temperature curing high-temperature-resistant impregnating adhesive and a preparation method thereof. The high-temperature curing high-temperature-resistant impregnating adhesive is formed by mixing a component A and a component B at the mass ratio of 4:1, wherein the component A is composed of bisphenol A type epoxy resin, a silane coupling agent and a thixotropic agent, and the component B is a modified aromatic amine curing agent. The high-temperature curing high-temperature-resistant impregnating adhesive can be cooperated with a carbon fiber composite material in use under the high temperature environment (above 100 DEG C) to reinforce the structure of a base material. The high-temperature impregnating adhesive is high in permeability, can fully infiltrate the carbon fiber composite material and the structural base material; after the impregnating adhesive is subjected to high-temperature curing for 24 hours, the colloidal performance of the adhesive layer is excellent, the adhesive strength is high, the impregnating adhesive can resist 250 DEG C and the service life is long.

Description

technical field [0001] The invention relates to the field of structural adhesives, in particular to a high-temperature curing high-temperature resistant impregnating adhesive and a preparation method thereof. Background technique [0002] Engineering structure reinforcement is an emerging industry, which refers to the necessary structural transformation and reinforcement when the structural system of a building or structure cannot meet the requirements of use. In the reinforcement of engineering structures, carbon fiber cloth reinforcement technology has the advantages of light weight, high strength, good corrosion resistance, easy construction and operation, no increase in the structure's self-weight and cross-sectional size, low requirements on the structure's shape, and can even improve the performance of the structure itself. It is widely used in the reinforcement of building beams, slabs, columns, walls, etc., as well as the maintenance and reinforcement of bridges, tun...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/06C08G59/50
CPCC09J163/00C08G59/5033C08K5/5419C08K5/5435C08K5/544C09J11/06
Inventor 周洪芝李新雷许小海
Owner CARBON COMPOSITESTIANJIN CO LTD
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