Vacuum packaging structure and packaging method thereof, device for vacuum packaging
A technology of vacuum packaging and carrier board, which is applied in the direction of semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve the problems of affecting performance, uneven temperature distribution of chip substrates, large size, etc., to reduce volume and ensure Excellent performance and temperature uniformity
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[0042] The specific implementation of the vacuum packaging structure, packaging method, and vacuum packaging device provided by the present invention will be described in detail below with reference to the accompanying drawings.
[0043] Please refer to figure 2 , the vacuum packaging structure is a vacuum packaging structure of an infrared detector chip, specifically comprising: a base 21 , a cap 210 , an infrared filter 212 , an infrared detector chip 26 and a getter layer 28 .
[0044] The material of the base 21 is ceramic, and the bottom of the base 21 may also be welded with metal pins 25 as electrical connection pins. The welding area 24 on the surface of the base 21 is plated with gold to form a firm weld with the cap 210 , and the thickness of the gold plating is greater than or equal to 0.8 microns.
[0045] The material of the cap 210 is Kovar. In other specific embodiments of the present invention, the material of the cap 210 can also be other metal materials wit...
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Abstract
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