Multifunctional solid material thermophysical property testing device and method

Abstract

The invention discloses a multifunctional solid material thermophysical property testing device and method. The device comprises a hot end compression plate and a cold end compression plate connected together through a compression device, wherein the hot end compression plate is in contact with a hot end sealing plate, the hot end sealing plate is connected with a heating plate through an elastic module, and the heating plate is fixed on a hot end base; a seal pipe is arranged between the hot end sealing plate and a cold end base, and the compression device generates a compression force through the hot end compression plate and the cold end compression plate to extrude a seal ring corresponding to the seal pipe so as to form a pressure-bearing seal chamber composed of the hot end sealing plate, the seal pipe and the cold end base; a temperature measuring device and a pressure measuring device are respectively used for measuring temperatures and pressures of a thermophysical property test sample to be tested in the pressure-bearing seal chamber before and after filling or drawing out a gas, and then the thermophysical property of a solid material is tested. The testing device and the testing method provided by the invention can eliminate test errors caused by thermal contact resistance, radiation and heat convection, thereby effectively improving the testing accuracy of thermophysical property parameters.

Description

technical field [0001] The invention relates to the technical field of testing, in particular to a device and method for testing thermal properties of a multifunctional solid material. Background technique [0002] At present, the status quo of solid material products is that with the development of material science, there is an increasing demand for testing thermal properties such as thermal conductivity and specific heat capacity of various new solid materials. Compared with the transient thermal property testing device with an initial investment of tens of millions, the initial investment of the steady-state method device can generally be controlled within 10,000 yuan. [0003] There are certain deficiencies in the test processing of thermophysical parameters. The steady-state method is mostly suitable for testing the thermal conductivity of materials, and it is not easy to test the specific heat capacity of materials. In addition, the size of the device required by the ...

AI Technical Summary

Problems solved by technology

[0003] It has certain deficiencies in the testing and processing of thermal physical parameters. The steady-state method is mostly suitable for testing the thermal conductivity of materials, but it is not easy to test the specific heat capacity of materials.

In addition, the size of the equipment required for the steady-state method is relatively large, and the preparation process is too complicated for many new materials

[0004] The document "GB / T 5598-1985 Determination Method for Thermal Conductivity of Beryllium Oxide Porcelain" discloses a small sheet structure thermal conductivity test device and test method, but it also has certain deficiencies. The device requires a huge sealed cavity. The vacuum method overcomes the impact of convective heat transfer on test accuracy, and there are multi-layer heat shields and multiple sets of water cooling devices to reduce the impact of radiation heat transfer on test accuracy, resulting in the overall size of the test device being too large, the shell is heavy and difficult to operate, and the constant temperature water system is complicated. difficult to control

[0005] On the other hand, with the gradual in-depth research on chemical gas-solid reaction and adsorption, the current research on the thermophysical properties of solid adsorption materials is no longer limited to the test of their inherent thermophysical properties. In order to reveal the changes in the heat transfer characteristics of the reaction or adsorption process, It is especially necessary to test the influence of conversion rate or adsorption amount on thermal physical properties. At present, there is no suitable special thermal physical property testing device using steady state method or transient method for this aspect of testing.

[0006] To sum up, in the prior art, there is still a lack of effective solutions for the testing of thermal and physical parameters such as thermal conductivity and specific heat capacity of various new solid materials.

Images