Production method of continuous long-distance resin diamond wire saw

Abstract

The invention discloses a production method of a continuous long-distance resin diamond wire saw, which comprises the steps of raw material selection, resin mixture preparation, core wire treatment, wire preparation, pre-curing, secondary curing and the like. The present invention effectively controls the final stage of line production by selecting thermoplastic resins and thermosetting resins with molecular weights within a suitable range; selecting suitable fillers, coupling agents, polymerization inhibitors, and dispersants; and controlling the appropriate initial viscosity of the resin mixture. The increase in the viscosity of the mixed liquid can effectively prevent the diameter of the diamond wire saw from becoming larger in the later stage of wire production, avoid the problem of local light caused by the gel particles of the mixed liquid blocking the drawing die, control the increase in the number of diamond micropowders, and ensure the quality of the product consistency. Ultimately solve the key technical problems in the continuous long-distance production of more than 70km.

Description

technical field [0001] The invention relates to the technical field of production of resin diamond wires for cutting solar crystal silicon wafers, in particular to a production method of continuous long-distance resin diamond wire saws. Background technique [0002] At present, the solar photovoltaic industry mainly uses steel wires to drive silicon carbide mortar to cut crystalline silicon wafers. However, the cutting speed of this free mortar is slow, the production efficiency is low, and the waste generated after cutting will also cause environmental pollution and safety hazards. Due to many restrictions, new cutting methods have been studied at home and abroad, among which resin diamond wire and electroplated diamond wire are the mainstream research directions. Compared with free mortar cutting, resin diamond wire has the following advantages: narrow slit, high cutting efficiency, low slicing cost, less wear of saw wire, avoiding the pollution of slurry in free abrasive,...

AI Technical Summary

Problems solved by technology

In the long-distance line, the resin will undergo partial chemical cross-linking and polymerization over time to produce tiny gel particles, resulting in blockage of the die

If the diamond wire produced in this way cuts the crystalline silicon wafer in the future, the resin layer will be peeled off when the light goes out, causing the resin diamond wire to fail prematurely and be scrapped, and the expensive silicon ingot that is cutting the crystalline silicon wafer is also scrapped. An important problem hindering the development of long-distance wire manufacturing technology

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