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Preparation method of palladium-copper alloy film with controllable components and thickness, palladium-copper alloy film and application

A technology of palladium-copper alloy and palladium film, which is applied to the preparation of palladium-copper alloy film with controllable composition and thickness and the field of palladium-copper alloy film and application, can solve problems such as difficulties, achieve accurate control, save production cost, high Effect of Low Temperature Hydrogen Permeability

Inactive Publication Date: 2017-06-09
DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The electroless plating (ELP) method based on autocatalytic reaction is widely used in experiments, production and other fields because of its simple equipment operation, strong adaptability to the shape of the carrier, and mild reaction. However, in order to obtain an ideal thickness, accurate Pd , the alloy film composed of Cu has certain difficulties

Method used

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  • Preparation method of palladium-copper alloy film with controllable components and thickness, palladium-copper alloy film and application
  • Preparation method of palladium-copper alloy film with controllable components and thickness, palladium-copper alloy film and application
  • Preparation method of palladium-copper alloy film with controllable components and thickness, palladium-copper alloy film and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] ECN1 porous ceramic material as support, 4μm thick Pd 50 Cu 50 Alloy film preparation

[0049] 1. Preparation of copper plating solution

[0050] Use HFA2004 analytical balance to weigh 30gNa 2 Dissolve EDTA in 400ml of warm water at 40°C-50°C, and record it as solution A for later use. Weigh 10g CuSO 4 ·5H 2 Dissolve O in 100ml of warm water at 40°C and record it as solution B. Add A to B under stirring slowly, the blue transparent solution produces a blue precipitate and becomes turbid. The reaction equation is:

[0051] Cu 2+ +2OH - →Cu(OH) 2 ↓Cu 2+ +Na 2 EDTA→CuEDTA+2Na +

[0052] Cu(OH) 2 +Na 2 EDTA→CuEDTA+2NaOH

[0053] Weigh 23g Na 2 CO 3 Dissolve in 100ml of warm water at 40°C. Record it as solution C, add C to B with slow stirring, the blue precipitate formed before gradually disappears, and the solution becomes clear again. Sonicate for 5 minutes to make the solution more uniform. Weigh 40mg C 10 h 8 o 2 Dissolve in 40ml distilled wate...

Embodiment 2

[0071] NJ1 porous ceramic material as carrier, 4μm thick Pd 47 Cu 53 Alloy film preparation

[0072] 1. Preparation of copper plating solution

[0073] Method is with embodiment 2.

[0074] 2. Preparation of Palladium Plating Solution

[0075] Method is with embodiment 2.

[0076] 3. Vector pretreatment

[0077] The NJ porous ceramic carrier tube is 67.90mm long, with an outer diameter of 12.50mm and an inner diameter of 8.05mm. First in Na 2 CO 3 Soak in the alcohol solution for 30 minutes to remove the oil on the surface. Then soak in deionized water, and vacuum wash at low pressure for 15 minutes to remove residual Na 2 CO 3 Alcoholic solution, after treatment, the carrier is white and bright. After that, dry it in an oven at 150°C for later use.

[0078] Activate the dried carrier, immerse in reducing agent (dimethylaminoborane), reduce for 3 to 5 minutes, rinse the carrier tube with distilled water, and then immerse in the mixture of palladium sulfate and bora...

Embodiment 3

[0087] ECN2 porous ceramic material as support, 5 μm thick Pd 45 Cu 55 Alloy film preparation

[0088] 1. Preparation of copper plating solution

[0089] Method is with embodiment 2.

[0090] 2. Preparation of Palladium Plating Solution

[0091] Method is with embodiment 2.

[0092] 3. Vector pretreatment

[0093] The ECN porous ceramic carrier tube has a length of 80.25 mm, an outer diameter of 14.00 mm, and an inner diameter of 11.05 mm. First in Na 2 CO 3 Soak in the alcohol solution for 30 minutes to remove the oil on the surface. Then soak in deionized water, and vacuum wash at low pressure for 15 minutes to remove residual Na 2 CO 3 Alcoholic solution, after treatment, the carrier is white and bright. After that, dry it in an oven at 150°C for later use.

[0094] Activate the dried carrier, immerse in reducing agent (dimethylaminoborane), reduce for 3 to 5 minutes, rinse the carrier tube with distilled water, and then immerse in the mixture of palladium sulfa...

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Abstract

The invention relates to a preparation method of a palladium-copper alloy film with controllable components and thickness, the palladium-copper alloy film and application. The preparation method comprises the steps that a layered plating method is adopted, metal palladium and copper are alternately deposited on a carrier to be placed layer by layer, the metal thickness and substance amount on each layer are controlled separately, finally, high-temperature alloying is carried out, and the compact palladium-copper alloy film is formed. According to the method, by controlling the quantity of electric charge of a system, metal palladium and copper with the corresponding volume are accurately deposited, and then the purpose of controlling the components of the alloy film is achieved. In addition, by adjusting and controlling the current density and controlling the film quality, quantities of electric charge in different stages are adjusted and controlled, the composition of the palladium-copper alloy film is controlled, and then the alloy film thickness is adjusted and controlled. Traditional chemical plating is broken through, the limit of metal reduction potential is broken through due to the limit that each layer needs the alloying step, and deposition of palladium metal on the copper-based surface is achieved. The preparation period of the alloy film is greatly shortened, the application range of the film is expanded, and the preparation method has the advantages of being simple in process and good in repeatability and is suitable for large-scale alloy film preparation.

Description

technical field [0001] The invention relates to an electroplating preparation technology of a palladium-copper alloy film with controllable composition and thickness. The method is based on Pd 2+ and Cu 2+ The principle of electron reduction reaction at the cathode realizes the reduction deposition of metal Pd and Cu on the porous ceramic carrier to form a film. The two metals are layered and alternately electroplated. By controlling the total charge of the electrochemical reaction, the thickness and composition of the alloy film can be controlled. control, and then can prepare a high-performance palladium-copper alloy film with an ideal thickness and a controllable composition. Background technique [0002] With the rapid development of membrane separation technology, it has been widely used in food, textile, medicine, chemical industry and many other fields. Taking the purification and separation of hydrogen as an example, the dense metal palladium membrane separation te...

Claims

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Application Information

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IPC IPC(8): C25D3/50C25D3/38C25D5/10C25D5/16
Inventor 安德烈斯·约瑟夫·哥德巴赫赵辰阳徐恒泳
Owner DALIAN INST OF CHEM PHYSICS CHINESE ACAD OF SCI
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