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Middle frame of terminal device, preparation method thereof and mobile terminal

A technology for terminal equipment and substrates, applied in the field of electronics, can solve problems affecting user experience, temperature rise control of the whole machine, complicated instructions, etc., to avoid excessive local temperature, improve thermal conductivity, and improve user experience.

Inactive Publication Date: 2017-05-31
QIKU INTERNET TECH SHENZHEN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the power consumption of the mobile phone's central processing unit (CPU) gradually increases, the instructions it runs become increasingly complex, and the thermal conductivity of the aluminum alloy has gradually become stretched, unable to meet the heat dissipation requirements of the terminal, and insufficient to control the temperature rise of the whole machine. Within a reasonable range, the problem of local overheating of the terminal often occurs, which seriously affects the user experience

Method used

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  • Middle frame of terminal device, preparation method thereof and mobile terminal
  • Middle frame of terminal device, preparation method thereof and mobile terminal
  • Middle frame of terminal device, preparation method thereof and mobile terminal

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] refer to Figure 1-Figure 4 , the middle frame of the terminal device according to the first embodiment of the present invention is proposed. The terminal device may be a mobile terminal such as a mobile phone or a tablet, or may be a fixed terminal such as a personal computer or a television set. illustrate.

[0053] The middle frame includes a base plate 10, and at least one heat pipe 20 (or heat pipe) is arranged inside the base plate 10. The heat pipe 20 extends from the first position of the base plate 10 to the second position of the base plate 10. When the terminal device is in operation, the second position The calorific value of one position is greater than that of the second position, that is, there is a temperature difference between the first position and the second position. The heat at the first position of the substrate 10 can be quickly transferred to the second position by utilizing the rapid temperature equalization characteristic of the heat pipe 20 ...

Embodiment 2

[0065] refer to Figure 5 , propose a method for preparing a middle frame of a terminal device according to a second embodiment of the present invention, the method includes the following steps:

[0066] S11. Place at least one heat pipe in the mold.

[0067] In the embodiment of the present invention, first, according to the assembly method of the middle frame and the terminal equipment (such as the assembly method of the main board), the direction and position of the heat pipe in the middle frame are planned (such as one end of the heat pipe corresponds to the position of the main board), and the length of the heat pipe is planned and quantity. Then, according to the plan, the heat pipe is fixed at the corresponding position of the mold for forming the substrate. The mold may be a die-casting mold, an injection mold, or the like.

[0068] When selecting the heat pipe, it is necessary to select the material of the shell of the heat pipe according to the material of the sub...

Embodiment 3

[0081] refer to Image 6 , propose a method for preparing a middle frame of a terminal device according to a third embodiment of the present invention, the method includes the following steps:

[0082] S21. Place at least one heat pipe in the mold.

[0083] S22. Inject molten metal material into the mould.

[0084] S23, demoulding after cooling and forming to obtain a metal plate with a heat pipe inside.

[0085] In this embodiment, steps S21-S23 are similar to steps S11-S13 in the second embodiment, and will not be repeated here.

[0086] S24. Using an injection molding process, injection molding a plastic plate connected to the periphery of the metal plate.

[0087] Specifically, first place the metal plate made in the previous step S23 in an injection mold, then inject molten plastic into the mold by injection molding process, cool down and form it, and demould to obtain a substrate, which includes a metal plate integrated with a heat pipe inside And the plastic plate c...

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Abstract

The invention discloses a middle frame of terminal device, a preparation method thereof and a mobile terminal. The middle frame comprises a base plate. At least one heat pipe is arranged in the base plate. The heat pipe stretches from a first position of the base plate to a second position of the base plate. When the terminal device operates, the heating value of the first position is greater than that of the second position. According to the middle frame of the terminal device provided by the embodiment of the invention, the heat pipe is integrated in the base plate of the middle frame; through utilization of a rapid temperature equalization feature of the heat pipe, the heat in a high temperature area of the base plate can be rapidly transferred to a low temperature area; the heat pipe has a very high heat conductivity coefficient, and generally, the heat conductivity coefficient is as high as thousands (W / m2.K); the heat conductive capability of the middle frame is greatly improved; the heat is rapidly and uniformly dissipated; the temperature rise of the complete machine of the terminal device is controlled in a reasonable range; the problem of partial overtemperature is avoided; and the use experience of the user is improved.

Description

technical field [0001] The invention relates to the field of electronic technology, in particular to a middle frame of a terminal device, a preparation method thereof and a mobile terminal. Background technique [0002] With the development of electronic technology, mobile terminals such as mobile phones and tablet computers are more and more widely used. In order to meet users' requirements for terminal functions and performance, the hardware of mobile terminals is continuously upgraded, and the calculation and processing performed are also more complex, which leads to continuous increase in power consumption, which leads to higher and higher temperatures of the main board and the whole machine of the terminal. At the same time, as users gradually upgrade their requirements on the battery life and charging time of the terminal, the battery capacity continues to increase and the charging current continues to increase. As a result, the temperature of the whole machine and the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H05K7/20
CPCH04M1/026H05K7/20336H05K7/2039
Inventor 李帅
Owner QIKU INTERNET TECH SHENZHEN CO LTD
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