Package method of integrated power supply system package element

Abstract

The invention provides a package method of an integrated power supply system package element. The method includes the following steps that a carrier is provided; a re-wiring layer is formed on the carrier; a columnar metal lead is formed on the re-wiring layer; an active module and a passive module of a power supply system bare core are welded to the re-wiring layer; the active module, the passive module and the columnar metal lead are packaged and formed on the re-wiring layer, and redundant packaging and forming materials for covering the active module, the passive module and the columnar metal lead are removed through grinding; a base solder protruding block connected with the columnar metal lead is formed, and the carrier is removed; a power consumption system bare core is welded to the re-wiring layer, and then the power consumption system bare core is packaged and fixed to the re-wiring layer through bottom filling. By means of the three-dimensional chip stacking technology, a power supply system is directly integrated on the lower portion of the power consumption system bare core, power transmission efficiency is improved, and the number of different usable voltage rails is increased.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging method for an integrated power supply system package. Background technique [0002] All computing and communication systems require a power supply system. The power supply system converts the high voltage of the power supply to the many different low voltages required by the discrete components in the system. The efficiency of the power delivery system determines the power loss for down conversion, while the number of supply rails determines the number of discrete voltage supplies or devices that can be supported. [0003] The current power supply technology faces the following challenges: [0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption. [0005] Second, adding more power supply rails requires duplic...

AI Technical Summary

Problems solved by technology

[0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption

[0005] 2. Adding more power supply rails requires duplicating more power supply components, such as increasing the number of components, increasing the size of the circuit board, increasing the number of layers of the circuit board, increasing the volume, cost and weight of the system

[0006] 3. Due to the limitation of the line distance and line width of the rewiring layer, the package size needs to be increased

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