Packaging method of package with integrated power transmission system

Abstract

The invention provides a packaging method for a package integrated with a power supply transmission system, comprising the following steps: 1) providing a carrier; 2) forming a first metal connecting post on the surface of the carrier by using an electroplating process; 3) connecting the active module and the wireless The source module is arranged on the surface of the carrier on which the first metal connection post is formed, and the second metal connection post is formed on the surface of the active module and the passive module; 4) the first metal connection post, the active module, the passive module The module and the second metal connecting column are packaged and molded; 5) Form a rewiring layer on the surface of the plastic packaging material; 6) Set the power chip on the surface of the rewiring layer, and the power chip realizes the connection with the low voltage power supply track through a plurality of micro bumps butt jointing; 7) peeling off the carrier to form a solder bump connected to the first metal connection post. The present invention improves power transmission efficiency and increases the available number of different voltage rails by using three-dimensional chip stacking technology.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging method for a package integrated with a power supply transmission system. Background technique [0002] All computing and communication systems require power transmission systems. The power delivery system converts the high voltage of the power supply to the many different low voltages required by the discrete components in the system. The efficiency of the power delivery system determines the power loss for down conversion, while the number of power rails determines the number of discrete voltage supplies or devices that can be supported. [0003] The current power supply technology faces the following challenges: [0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption. [0005] Second, adding more power sup...

AI Technical Summary

Problems solved by technology

[0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption

[0005] 2. Adding more power supply rails requires duplicating more power supply components, such as increasing the number of components, increasing the size of the circuit board, increasing the number of layers of the circuit board, increasing the volume, cost and weight of the system

[0006] 3. Due to the limitation of the line distance and line width of the rewiring layer, the package size needs to be increased

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