Packaging method for package integrated with power transmission system

Abstract

The present invention provides a packaging method for a package integrated with a power supply transmission system, comprising the following steps: 1) providing a carrier; 2) forming metal leads on the surface of the carrier by a wire bonding process; 3) combining the active module and the passive The module is arranged on the surface of the carrier on which the metal leads are formed, and metal connecting posts are formed on the surfaces of the active module and the passive module; 4) The metal leads, the active modules, the passive modules and the metal connecting posts are encapsulated and molded; 5 ) Form a redistribution layer on the surface of the plastic packaging material; 6) Set the electrical chip on the surface of the redistribution layer, and connect the electrical chip with the low-voltage power supply rail through a plurality of micro-bumps; 7) Peel off the carrier to form a metal lead connected solder bumps. The present invention improves power delivery efficiency and increases the available number of different voltage rails by using three-dimensional chip stacking technology.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging method for a package integrated with a power supply transmission system. Background technique [0002] All computing and communication systems require power transmission systems. The power delivery system converts the high voltage of the power supply to the many different low voltages required by the discrete components in the system. The efficiency of the power delivery system determines the power loss for down conversion, while the number of power rails determines the number of discrete voltage supplies or devices that can be supported. [0003] The current power supply technology faces the following challenges: [0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption. [0005] Second, adding more power sup...

AI Technical Summary

Problems solved by technology

[0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption

[0005] 2. Adding more power supply rails requires duplicating more power supply components, such as increasing the number of components, increasing the size of the circuit board, increasing the number of layers of the circuit board, increasing the volume, cost and weight of the system

[0006] 3. Due to the limitation of the line distance and line width of the rewiring layer, the package size needs to be increased

Images