Packaging method of packaging member integrated with power transmission system

Abstract

The invention provides a packaging method of a packaging member integrated with a power transmission system. The method comprises the following steps: 1) providing a carrier; 2) forming a metal lead on the surface of the carrier by using a lead bonding process; 3) disposing an active module and a passive module on the surface, where the metal lead is formed, of the carrier and forming metal connecting columns on the surfaces of the active module and the passive module; 4) packaging the metal lead, the active module, the passive module and the metal connecting column; 5) forming a rewiring layer on the surface of a plastic packaging material; 6) disposing an electric chip on the surface of the rewiring layer, wherein the electric chip is connected with a low-voltage power supply track via a plurality of micro bumps; 7) stripping the carrier and forming a solder bump connected with the metal lead. The method improves the power transmission efficiency by using a three-dimensional chip stacking technology, and increases the available quantity of different voltage tracks.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging method for a package integrated with a power supply transmission system. Background technique [0002] All computing and communication systems require power transmission systems. The power delivery system converts the high voltage of the power supply to the many different low voltages required by the discrete components in the system. The efficiency of the power delivery system determines the power loss for down conversion, while the number of power rails determines the number of discrete voltage supplies or devices that can be supported. [0003] The current power supply technology faces the following challenges: [0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption. [0005] Second, adding more power sup...

AI Technical Summary

Problems solved by technology

[0004] 1. With the contraction of nodes in the process and the reduction of equipment voltage, the efficiency of power transmission will decrease accordingly, resulting in greater power consumption

[0005] 2. Adding more power supply rails requires duplicating more power supply components, such as increasing the number of components, increasing the size of the circuit board, increasing the number of layers of the circuit board, increasing the volume, cost and weight of the system

[0006] 3. Due to the limitation of the line distance and line width of the rewiring layer, the package size needs to be increased

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