A self-promoting burning type electronic paste and preparation method thereof
A technology of electronic paste and paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., can solve problems such as residual resin, performance defects, and unstable product performance, and achieve reduction Carbon content, effect of improving performance stability
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Embodiment 1
[0026]Embodiment 1, a self-promoting sintering type electronic paste, including the following materials by weight, specifically:
[0027] Solid phase 60%
[0028] Organic binder phase 40%.
[0029] Wherein, solid phase is made up of silver powder, palladium powder, glass powder, potassium permanganate, and the weight portion of silver powder, palladium powder, glass powder, potassium permanganate in solid phase is successively 50%, 25%, 15%, 10% .
[0030] The weight portion of the glass powder in this slurry is 9%, contains SiO in the glass powder 2 、 Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO, TeO 2 , SiO in glass powder 2 、 Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO, TeO 2 The parts by weight are 20%, 45%, 10%, 5%, 5%, 5%, 5%, 10% in turn.
[0031] In addition, the weight portion of the organic binding phase in the slurry is 40%, and the organic binding phase includes resin, solvent, and auxiliary agent; wherein, the resin is ethyl cellulose, the solvent is ...
Embodiment 2
[0045] Embodiment 2, a self-promoting sintering type electronic paste, including the following materials by weight, specifically:
[0046] Solid phase 65%
[0047] Organic binder phase 35%.
[0048] Wherein, solid phase is made up of silver powder, palladium powder, glass powder, potassium permanganate, and the weight parts of silver powder, ruthenium oxide powder, glass powder, potassium permanganate in solid phase are successively 25%, 50%, 20%, 5%. %.
[0049] The weight portion of the glass powder in this slurry is 13%, contains SiO2 in the glass powder 2 、 Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO, TeO 2 , SiO in glass powder 2 、 Bi 2 o 3 , B 2 o 3 , ZnO, SnO 2 , CuO, BaO, TeO 2 The parts by weight are 15%, 47%, 10%, 5%, 5%, 5%, 5%, 13%.
[0050] In addition, the weight portion of the organic binding phase in the slurry is 35%, and the organic binding phase includes resin, solvent, and auxiliary agent; wherein, the resin is ethyl cellulose, the solvent is...
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