Solid nanometer particle-thickened paraffin aggregate and preparation method thereof
A nano-aggregate technology, which is applied in the field of wax aggregates thickened by solid nano-particles and its preparation, can solve the problems of wax flowing and melting at high temperature, and achieve the effect of solving high-temperature flowing and melting
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Embodiment 1
[0021] Heat 88.0g of 50# paraffin and 5.5g of diphenylsilanediol to 100°C, stir for 10 minutes to dissolve completely to obtain a paraffin system. Under the condition of high-speed stirring (500 rpm), 16.5g of nano-silicon nitride was added to the paraffin wax system, and the reaction was continued at 100°C for 10 minutes to make the stirring even, then the temperature was raised to 200°C, and the reaction was 2.5h. Add 0.5g of polymethacrylate at 100°C, stir evenly, let stand and cool to room temperature to obtain the product.
Embodiment 2
[0023] Heat 41.0g of 50# paraffin and 41.0g of base oil to 80°C, stir for 20 minutes to dissolve completely to obtain a paraffin system. Add 18.0g of nano-silicon nitride into the paraffin wax system under high-speed stirring conditions (600 rpm), continue to stir and react at 80°C for 15 minutes to make the stirring even, then raise the temperature to 190°C, react for 2 hours, stop heating, and let it stand for cooling The product was obtained at room temperature.
Embodiment 3
[0025] Heat 88.0g of 50# paraffin and 5.0g of diphenylsilanediol to 100°C, stir for 10 minutes to dissolve completely to obtain a paraffin system. Under high-speed stirring conditions (500 rpm), 16.5g of nano-silicon nitride was added to the paraffin wax system, and the reaction was continued at 100°C for 10 minutes to make the stirring even, then the temperature was raised to 180°C, 5.5g of expanded graphite was added, and the reaction was continued at 180°C. Stir at ℃ for 10 minutes to make the stirring uniform, then raise the temperature to 195℃, react for 1.0h, stop heating, let stand and cool to room temperature to obtain the product.
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