LED packaging material with good heat conductivity and fluorescence function and preparation method of LED packaging material

A technology of LED packaging and thermal conductivity, which is applied in semiconductor devices, electrical components, circuits, etc., can solve the problems of no fluorescent function and lack of anti-cracking performance, so as to avoid direct contact, improve service life and comprehensive quality, and thermal conductivity excellent effect

Inactive Publication Date: 2017-05-31
安徽中威光电材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Liu Jinlong used vinyl silicone oil and hydrogen-containing silicone oil cross-linking agents to prepare silicone materials for LED packaging in his master's thesis "Preparation and Performance Research of Silicone Materials for LED Packaging", but there are still lack of anti-cracking properties, no Fluorescent function and other issues

Method used

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Effect test

Embodiment

[0017] An LED packaging material with good thermal conductivity and fluorescent function is characterized in that it is made of the following raw materials in parts by weight:

[0018] Carbon nanotube 4, vinyl silicone oil 40, diamond 2, vinyl MQ resin 11, xylene 20, citric acid 8, ethylenediamine 6, polyethylene glycol 4, deionized water 10, silicon powder 10, silane coupling Agent KH550 10, hydrogen-containing silicone oil crosslinking agent 35, chloroplatinic acid isopropanol 3.

[0019] The described LED encapsulation material with good thermal conductivity and fluorescent function and its preparation method is characterized in that it is made by the following steps:

[0020] a. Put vinyl silicone oil and polyethylene glycol into a container equipped with a stirrer and a thermocouple, and raise the temperature to 80-120°C; dissolve vinyl MQ resin in xylene solution, stir until dissolved, then slowly add Add it to the above-mentioned vinyl silicone oil, continue stirring a...

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PUM

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Abstract

The invention discloses an LED packaging material with good heat conductivity and a fluorescence function and a preparation method of the LED packaging material. The LED packaging material is characterized by being prepared from raw materials in parts by weight as follows: 2-4 parts of carbon nanotubes, 30-40 parts of vinyl silicone oil, 1-2 parts of diamond, 7-11 parts of vinyl MQ resin, 10-20 parts of dimethylbenzene, 4-8 parts of citric acid, 3-6 parts of ethylenediamine, 2-4 parts of polyethylene glycol, 5-10 parts of deionized water, 5-10 parts of silica powder, 5-10 parts of a silane coupling agent KH550, 25-35 parts of a hydrogen-containing silicone oil crosslinking agent and 2-3 parts of isopropanol chloroplatinate. The silica powder is soaked with a carbon spot fluorescent material and is introduced into a silicone material for packaging, and the obtained silicone material has a fluorescent function and excellent anti-cracking performance; in cooperation with the added carbon nanotubes and the like, the material has excellent heat conductivity.

Description

technical field [0001] The invention relates to an LED packaging material, in particular to an LED packaging material with good thermal conductivity and fluorescent function and a preparation method thereof. Background technique [0002] Silicone materials for LED packaging are usually based on vinyl silicone resin or vinyl silicone oil, and low-viscosity hydrogen-containing silicone oil is used as a crosslinking agent. Obtained by cross-linking and curing. With the advancement of LED packaging technology, especially the development of high-power white LEDs, silicone-based packaging materials are increasingly showing their advantages. Silicone materials for LED packaging are different from ordinary silicone materials. In addition to having good mechanical properties, they must also maintain excellent heat resistance and high transparency. The preparation of silicone packaging materials mostly adopts a two-component addition formula system, which is formed by thermal curing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08L71/02C08K13/06C08K9/12C08K9/06C08K7/24C08K3/36C08K3/04H01L33/56
CPCC08K2201/014C08L83/04C08L2201/08C08L2203/206C08L2205/025C08L2205/035H01L33/56C08L71/02C08K13/06C08K9/12C08K9/06C08K7/24C08K3/36C08K3/04
Inventor 鲍启兵刘芳俞泽涛
Owner 安徽中威光电材料有限公司
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