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Palladium plating solution and palladium coating obtained using same

A technology of plating solution and palladium salt, which is applied in liquid chemical plating, metal material coating technology, coating, etc., can solve the problems of insufficient physical properties of the coating, and achieve the effects of cost reduction, cost reduction, and film thickness reduction

Active Publication Date: 2017-05-10
JAPAN PURE CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in these conventional technologies, it is not sufficient to further reduce the amount of gold used to reduce the cost by reducing the amount of expensive gold used, while maintaining the physical properties of the film with stable heat resistance. needs further improvement

Method used

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  • Palladium plating solution and palladium coating obtained using same
  • Palladium plating solution and palladium coating obtained using same
  • Palladium plating solution and palladium coating obtained using same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～8、 comparative example 1～7

[0186]

[0187] With respect to the whole palladium plating solution, the specific pyridinium compound or its comparative compound described in each embodiment and each comparative example shown in Table 1 is respectively 1000ppm, Formic acid as a reducing agent was dissolved at 1000 ppm and citric acid as a component of a conductivity salt and a buffer was dissolved at 100 g / L to adjust the pH to 6.5 to prepare an electroless palladium plating bath. However, Comparative Example 7 contained neither the specific pyridinium compound nor the comparative compound.

[0188] As "comparative compounds", pyridine, pyridine-3-sulfonic acid, picoline, quinolinesulfonic acid, 2,3-diaminopyridine, and 3-(3-pyridyl)acrylic acid were used.

[0189] In addition, as Comparative Example 7, a palladium plating solution prepared in the same manner that contained neither the "specific pyridinium compound" nor the "comparative compound" was evaluated.

[0190] The pH of the electroless palladiu...

Embodiment 11～18

[0220] The same evaluation samples as those used in Examples 1 to 8 were produced, and gold coatings of 0.01 μm, 0.05 μm, and 0.1 μm were respectively formed thereon.

[0221] A heat resistance test was conducted. As a result, any of Examples 11 to 18 contained less than 10% of nickel and less than 0.5% of copper in any thickness of the gold coating, so all were judged to be good products.

Embodiment 21

[0227]

[0228] With respect to the whole palladium plating solution, the specific pyridinium compound (1-methyl-3-carboxypyridinium hydrochloride) as in Example 1 was 1000ppm based on the dichlorotetraammine palladium solution as 1 g / L in terms of palladium. Dissolved with citric acid, which is a component serving as a conductivity salt and a buffer agent, at 100 g / L, adjusted the pH to 6.5, and prepared an electrolytic palladium plating solution.

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Abstract

The present invention addresses the problem of providing a palladium plating solution in which occurrence of defective parts such as pin holes on a palladium coating is reduced, and in which heat resistance performance equivalent to that obtained conventionally can be obtained even when a gold plating coating formed on the palladium coating is made thinner. The problem was overcome by: a palladium plating solution containing a soluble palladium salt as a palladium source, and a specific pyridinium compound in which an alkyl group is bonded to a nitrogen atom at the 1-position and one to five of the 2- to 6-positions are substituted with one or more specific substituents selected from the group consisting of an alkyl group, an aryl group, a carboxy group, an alkoxycarbonyl group, a sulfo group, an alkoxy sulfonyl group, an amino group, an alkylamino group, a dialkylamino group, and a cyano group; and a palladium coating obtained by performing palladium plating on a nickel, nickel alloy, copper, or copper alloy coating using the palladium plating solution.

Description

technical field [0001] The present invention relates to a palladium plating solution having a specific composition, a palladium coating (film) obtained by using the palladium plating solution, and particularly a palladium coating on nickel, nickel alloy, copper or copper alloy coating. Background technique [0002] Precious metal plating, especially gold plating, is widely used because of its excellent corrosion resistance, mechanical properties, electrical properties, and the like. Especially for the gold plating layer applied on the nickel coating, gold has excellent corrosion resistance, mechanical properties, electrical properties, etc., and nickel has excellent heat resistance as a base metal, etc., so it is used in the field of electronic and electrical components widely used. [0003] In recent years, in order to reduce production costs, it has been proposed to reduce the cost by thinning the gold coating, and to compensate for the heat resistance caused by the thinn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/44C23C18/52C25D3/50
CPCC25D3/50C23C18/44C23C18/52C23C18/42
Inventor 清原欢三柴田和也大须贺隆太中川裕介大久保祐弥
Owner JAPAN PURE CHEM
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