Polyimide film with low thermal expansion coefficient and preparation method of polyimide film

A technology of polyimide film and low thermal expansion coefficient, which is applied in the field of polyimide film with low thermal expansion coefficient and its preparation, can solve the problems of thermal expansion coefficient difference, material or device failure, delamination, etc., and achieve the reduction of thermal expansion coefficient , improve the interaction force, and improve the effect of orderly arrangement

Active Publication Date: 2017-03-29
株洲天颐莱新材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, polyimide has a large thermal expansion coefficient (40-80×10 -6 / K), which greatly limits its application range, especially in the microelectronics industry, as in the above-mentioned packaging circuit, there is a large difference in thermal expansion coefficient between polyimide and conductive material or substrate (such as The coefficient of thermal expansion of Cu is 16-18×10 -6 / K, SiO 2 The coefficient of thermal expansion is 14×10 -6 / K, Si thermal expansion coefficient is 3-6×10 -6 / K), serious thermal expansion coefficient mismatch will lead to delamination or cracking of the packaging material during the heat treatment of the packaging process or during the use of the packaged circuit, and even lead to the failure of the material or device

Method used

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  • Polyimide film with low thermal expansion coefficient and preparation method of polyimide film
  • Polyimide film with low thermal expansion coefficient and preparation method of polyimide film
  • Polyimide film with low thermal expansion coefficient and preparation method of polyimide film

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Experimental program
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Effect test

Embodiment 1

[0034] In this embodiment, the polyimide resin material has the following structural formula:

[0035]

[0036] The specific preparation method is:

[0037] (1), under nitrogen protection, 4.0mmol of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4.0mmol of 4,4'-diaminobiphenyl, 15ml of N-methylpyrrolidone Add it into the reaction bottle, stir at room temperature for 8 hours, and prepare a viscous polyamic acid solution A;

[0038] (2), under the protection of nitrogen, add 4.0mmol of terephthalamide dianhydride, 4.0mmol of 2-(4-aminophenyl)-6-aminobenzimidazole, and 15ml of N-methylpyrrolidone into the reaction flask , stirring at room temperature for 8 hours to prepare a viscous polyamic acid solution B;

[0039] (3), polyamic acid solution A and polyamic acid solution B were mixed together, and stirred at room temperature for 8 hours to prepare the final polyamic acid solution;

[0040] (4), the prepared polyamic acid solution is configured into a solution with a conc...

Embodiment 2

[0043] In this embodiment, the polyimide resin material has the following structural formula:

[0044]

[0045] The specific preparation method is:

[0046] (1), under nitrogen protection, 2.0mmol of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 4.0mmol of 4,4'-diaminobiphenyl, 15ml of N-methylpyrrolidone Add it into the reaction bottle, stir at room temperature for 8 hours, and prepare a viscous polyamic acid solution A;

[0047] (2), under the protection of nitrogen, add 6.0mmol of terephthalamide dianhydride, 4.0mmol of 2-(4-aminophenyl)-6-aminobenzimidazole, and 15ml of N-methylpyrrolidone into the reaction flask , stirring at room temperature for 8 hours to prepare a viscous polyamic acid solution B;

[0048] (3), polyamic acid solution A and polyamic acid solution B were mixed together, and stirred at room temperature for 8 hours to prepare the final polyamic acid solution;

[0049] (4) Obtain a polyimide film according to the film drying treatment method in Examp...

Embodiment 3

[0052] In this embodiment, the polyimide resin material has the following structural formula:

[0053]

[0054] The specific preparation method is:

[0055] (1) Under nitrogen protection, 1.0 mmol of 3,3',4,4'-biphenyltetracarboxylic dianhydride, 3.0 mmol of 4,4'-diaminobiphenyl, 10 ml of N,N-diphenyl Methylacetamide was added to the reaction flask, and stirred at room temperature for 8 hours to prepare a viscous polyamic acid solution A;

[0056] (2), under nitrogen protection, mix 7.0mmol of terephthalamide dianhydride, 5.0mmol of 2-(4-aminophenyl)-6-aminobenzimidazole, 20ml of N,N-dimethylacetamide Add it into the reaction bottle, stir at room temperature for 8 hours, and prepare a viscous polyamic acid solution B;

[0057] (3), polyamic acid solution A and polyamic acid solution B were mixed together, and stirred at room temperature for 8 hours to prepare the final polyamic acid solution;

[0058] (4), the prepared polyamic acid solution is configured into a solution...

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Abstract

The invention belongs to the field of high polymer materials and particularly relates to a polyimide film with a low thermal expansion coefficient and a preparation method of the polyimide film. The polyimide film has the following structural formula shown in the specification, wherein R1 and R3 are residues of two different tetracarboxylic acid dianhydride monomers, and R2 and R4 are residues of two different di-primary amine monomers. The preparation method is a multi-step polymerization method, firstly, two polyimide acid solutions with different structure units are obtained through polymerization respectively, then the solutions are mixed and then polymerized, finally, heating drying is carried out, and the polyimide film with the low thermal expansion coefficient is obtained. Compared with the prior art, the polyimide film with the low thermal expansion coefficient introduces ester bonds/amide, imidazole/oxazole and other structure units into molecular structure design at the same time, the interaction force among molecules is improved, the thermal expansion coefficient of the polyimide film is effectively reduced, meanwhile, the thermal expansion coefficient of the polyimide film can be adjusted and controlled by adopting different formulas, and the matching problem among different substrate materials is solved.

Description

technical field [0001] The invention belongs to the field of polymer materials, and in particular relates to a polyimide film with low thermal expansion coefficient and a preparation method thereof. Background technique [0002] Polyimide is the most important variety of aromatic heterocyclic polymers developed in the past half century, and it is also a type of polymer material with the highest service temperature. It has high mechanical strength, high temperature resistance, chemical stability, and creep resistance. With excellent comprehensive performance, it has been widely used in aviation, aerospace, electrical, mechanical, microelectronics, chemical industry and other fields. [0003] However, polyimide has a large thermal expansion coefficient (40-80×10 -6 / K), which greatly limits its application range, especially in the microelectronics industry, as in the above-mentioned packaging circuit, there is a large difference in thermal expansion coefficient between polyim...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08J5/18C08G73/10
CPCC08G73/1067C08J5/18C08J2379/08C08L79/08C08L2203/16
Inventor 屠国力方省众姜鹏飞
Owner 株洲天颐莱新材料技术有限公司
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