Method for preparing hexagonal spiral morphology bismuth telluride thermoelectric thin film
A technology of thermoelectric thin film and bismuth telluride, which is applied in the direction of thermoelectric device node lead wire material, ion implantation plating, coating, etc., can solve the problems of single shape of thermoelectric thin film material and poor thermoelectric performance, and achieve low thermal conductivity , high power factor, performance improvement effect
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Embodiment 1
[0029] (1) Before starting the preparation, clean the cavity of the magnetron sputtering equipment, and wipe the target head, shield cover and other parts with acetone;
[0030] (2) Mix the metal powder Bi with a purity of 99.999% and the metal powder Te with a purity of 99.999% according to the molar ratio of Bi:Te=2:3, and use a hot isostatic pressing device under the condition of 200MPa to make a size of Φ75mm ×5mm bismuth telluride alloy target, and install the bismuth telluride alloy target on the target head connected to the DC source in the magnetron sputtering chamber;
[0031] (3) The metal powder Te with a purity of 99.999% is used under the condition of 150MPa to make a tellurium simple substance target with a size of Φ75mm×5mm by using a hot isostatic pressing device, and the tellurium simple substance target is installed in the magnetron sputtering chamber and On the target head connected to the RF source;
[0032] (4) Place the quartz glass sheet as the substrate ...
Embodiment 2
[0043] (1) Before starting the preparation, clean the cavity of the magnetron sputtering equipment, and wipe the target head, shield cover and other parts with acetone;
[0044] (2) Mix the metal powder Bi with a purity of 99.999% and the metal powder Te with a purity of 99.999% according to the molar ratio of Bi:Te=2:3, and use a hot isostatic pressing device under the condition of 200MPa to make a size of Φ75mm ×5mm high-density bismuth telluride alloy target, and install the bismuth telluride alloy target on the target head connected to the DC source in the magnetron sputtering chamber;
[0045] (3) The metal powder Te with a purity of 99.999% is used under the condition of 150MPa to make a high-density tellurium simple substance target with a size of Φ75mm×5mm by using a hot isostatic pressing device, and the tellurium simple substance target is installed on the magnetron sputtering On the target head connected to the radio frequency source in the chamber;
[0046] (4) Pl...
Embodiment 3
[0057] (1) Before starting the preparation, clean the cavity of the magnetron sputtering equipment, and wipe the target head, shield cover and other parts with acetone;
[0058] (2) Mix the metal powder Bi with a purity of 99.999% and the metal powder Te with a purity of 99.999% according to the molar ratio of Bi:Te=2:3, and use a hot isostatic pressing device under the condition of 200MPa to make a size of Φ75mm ×5mm high-density bismuth telluride alloy target, and install the bismuth telluride alloy target on the target head connected to the DC source in the magnetron sputtering chamber;
[0059] (3) The metal powder Te with a purity of 99.999% is used under the condition of 150MPa to make a high-density tellurium simple substance target with a size of Φ75mm×5mm by using a hot isostatic pressing device, and the tellurium simple substance target is installed on the magnetron sputtering On the target head connected to the radio frequency source in the chamber;
[0060] (4) Pl...
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