LCP substrate-based encapsulation shell and preparation method

Abstract

The present invention relates to an LCP substrate-based encapsulation shell and a preparation method. The encapsulation shell comprises a metal enclosure, a LCP substrate composite layer which is arranged below the metal enclosure, and a metal cover plate which covers the metal enclosure; a plurality of LCP substrates which are connected with one another and are laminated so as to form the LCP substrate composite layer; the metal enclosure is in airtight connection with the LCP substrate composite layer; the metal cover plate is in airtight connection with the metal enclosure; the LCP substrate composite layer includes a chip adhesive layer, a gold wire bonding layer, components and a metal enclosure welding layer which are connected with one another sequentially; through holes are formed in the metal enclosure welding layer, so that excellent grounding and space isolation are realized; and electroplated solid holes are formed in each layer of the LCP substrate composite layer, so that electrical connection between any layers can be realized. The shell of the invention has the advantages of high air tightness, small size and light weight, and can be applied to high-frequency integrated circuits such as microwave and millimeter wave integrated circuits.

Description

technical field [0001] The invention belongs to the technical field of integrated circuit manufacturing, and relates to a package cavity-type casing in high-density packaging, which is used for high-reliability packaging for high-frequency applications such as microwaves and millimeter waves. Specifically, it is a cavity structure, The encapsulation preparation method adopts the LCP substrate as the substrate in the sealing area. Background technique [0002] At present, there are mainly two packaging methods for integrated circuits: one is plastic packaging using PCB substrate as the substrate, and the other is multilayer ceramic packaging using high-temperature co-fired ceramics. The two use completely different packaging materials and processes. Ceramic packaging can achieve hermetic packaging, but the cost is high, the manufacturing process is complicated, and the processing cycle is long. Moreover, because the conductor material of the ceramic substrate is Mo or W, the ...

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Problems solved by technology

The two use completely different packaging materials and processes. Ceramic packaging can achieve hermetic packaging, but the cost is high, the manufacturing process is complicated, and the processing cycle is long. Moreover, because the conductor material of the ceramic substrate is Mo or W, the embedded high-frequency signal The loss of the transmission line is very large, which limits the use of ceramic packages in high-frequency circuits such as millimeter waves, especially when embedded radio frequency transmission lines are required

The advantage of plastic packaging is low cost, but the application of plastic packaging in high-reliability integrated circuits is limited due to the inability to achieve airtight packaging. In addition, due to the high processing difficulty of PCB substrates to achieve any layer interconnection and the plastic packaging has no shielding effect on electromagnetic waves, restrictions The application of plastic package in ultra-high integration substrate and high frequency

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