Processing method of long-service-life copper manganese alloy target material

A copper-manganese alloy and processing method technology, which is applied in the field of target manufacturing, can solve problems such as not involving Cu-Mn alloy targets, and achieve the effects of improving the life of the target and improving the utilization rate of the target.

Inactive Publication Date: 2017-02-15
GRIKIN ADVANCED MATERIALS
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Problems solved by technology

The article proposes an ultra-fine grain processing method for Cu-Al alloys, but does not involve Cu-Mn alloy targets

Method used

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  • Processing method of long-service-life copper manganese alloy target material
  • Processing method of long-service-life copper manganese alloy target material
  • Processing method of long-service-life copper manganese alloy target material

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Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0031] Embodiment 1-5: the results are shown in Table 1 and Figure 1-Figure 3 shown;

[0032] The specification of the copper-manganese alloy ingot is φ200×260t, and it is hot forged at 500-800°C. The forging method is X / Y / Z three-way upsetting and drawing, and the upsetting and drawing ratio is 2:1. System φ580×30t; then recrystallization heat treatment to obtain the original billet.

[0033] Use friction stir processing for grain refinement at a rotational speed of 400-600r / min to obtain a long-life copper-manganese alloy sputtering target. Water cooling is carried out during the grain refinement process, and then the blank is subjected to 300°C stress relief annealing.

[0034] The results obtained are shown in Table 1. It can be seen that under the condition of the rotational speed of 400-600r / min, friction stir processing is used for grain refinement, and the average grain size of the obtained long-life copper-manganese alloy sputtering target is below 5 μm. With the ...

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Abstract

The invention discloses a processing method of a long-service-life copper manganese alloy target material, and belongs to the technical field of sputtering target material manufacturing. The method mainly comprises the steps that a copper manganese alloy cast ingot is processed by a conventional heat mechanical treatment method to obtain an original blank; the original blank is subjected to grain refinement through stirring and friction processing; the preparation of the long-service-life copper manganese alloy target material is realized; the service life of the target material can be effectively prolonged; and the utilization rate of the target material is improved. The obtained long-service-life copper manganese alloy target material has the advantages that the average grain size is less than 5 [mu]m; the service life can reach 3000kwh; and the texture orientation is in random distribution, so that the requirement of the technical process of 45nm or lower of an integrated circuit can be met.

Description

technical field [0001] The invention belongs to the technical field of target material manufacturing, and in particular relates to a processing method for a long-life copper-manganese alloy target material. Background technique [0002] The sputtering target is one of the important raw materials in the preparation process of semiconductor integrated circuits. The target materials mainly include Al, Cu, Ti, WTi, NiV, NiPt, etc., and are mainly used for contacts, through holes, and interconnection lines in integrated circuits. , Barrier layer, packaging and other physical vapor deposition film preparation. During sputtering, the target surface is bombarded with accelerated ions, causing surface atoms to deposit on the substrate surface. In order to reduce the manufacturing cost of integrated circuits, the simplest and most effective method is to increase the life of the target. The conventional method to increase the life of the target is to increase the thickness of the sput...

Claims

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Application Information

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IPC IPC(8): C23C14/34C22F1/08
CPCC23C14/3414C22F1/08
Inventor 曾浩李勇军张洋洋罗俊锋陈明王越庞欣熊晓东章程
Owner GRIKIN ADVANCED MATERIALS
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