Chemical plating solution for Ni-P plated layer and controllable preparation method of micro-nano mold

A technology of chemical plating solution and coating, applied in liquid chemical plating, coating, metal material coating process and other directions, can solve the problems of slow deposition rate, uniformity, hardness and corrosion resistance of the coating, and improve the processing Efficiency and processing quality, reduction of processing cost, effect of increased deposition speed

Inactive Publication Date: 2017-02-08
BEIJING INSTITUTE OF TECHNOLOGYGY
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  • Claims
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Problems solved by technology

[0007] What the present invention aims to solve is the technical problems such as slow coating deposition rate, insufficient uniformity, hardness and corrosion resistance during the processing of the existing glass micro-nano array Ni-P coating mold, and the embodiment of the present invention provides Ni-P coating electroless plating Liquid and controllable method of preparing micro-nano molds. The Ni-P coating deposited on the base material by electroless plating can maintain high hardness at the glass molding temperature, and at the same time, it can be processed with a diamond tool to obtain high-quality surface micro-nano array molding. with mold

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  • Chemical plating solution for Ni-P plated layer and controllable preparation method of micro-nano mold
  • Chemical plating solution for Ni-P plated layer and controllable preparation method of micro-nano mold
  • Chemical plating solution for Ni-P plated layer and controllable preparation method of micro-nano mold

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Embodiment approach

[0054] As an embodiment of the present invention, this embodiment provides a Ni-P plating electroless plating solution, including NiSO as the main salt 4 ·6H 2 O, NaH as reducing agent 2 PO 2 ·H 2 O, and complexing agents and stabilizers, among them, NiSO 4 ·6H 2 The concentration of O is greater than 25g / L; NaH 2 PO 2 ·H 2 The concentration of O is 16-28g / L.

[0055] A kind of commonly used Ni-P coating electroless plating solution formula that exists in the prior art is: concentration is 25g / L NiSO 4 ·6H 2 O, NaH at a concentration of 25g / L 2 PO 2 ·H 2 O, the concentration is 25g / L sodium acetate (CH 3 COONa), boric acid (H 3 BO 3 ), and the concentration as stabilizer is the thiourea of ​​2g / L, and the pH value of plating solution is adjusted to 5.8.

[0056] As the preference of this embodiment, choose NiSO 4 ·6H 2 The concentration of O is 27g / L; Complexing agent selects lactic acid and propionic acid, wherein, the concentration of lactic acid is 25g / L, ...

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Abstract

The embodiment of the invention provides a chemical plating solution for a Ni-P plated layer. The chemical plating solution comprises a main salt NiSO4.6H2O of which the concentration is 27 g / L, a reductant NaH2PO2.H2O of which the concentration is 16-28 g / L, a complexant lactic acid, a complexant propionic acid, and a stabilizer thiourea of which the concentration is 1 mg / L, wherein the pH value of the chemical plating solution is adjusted to be 4.5-5. The embodiment of the invention further provides a controllable preparation method of a micro-nano mold. According to the controllable preparation method, the chemical plating solution is utilized, and the Ni-P plated layer is prepared by adopting an ultrasonic vibration-assisted chemical plating method, Through improvement of the composition of the chemical plating solution, the deposition velocity of the plated layer is greatly improved, the prepared plated layer is higher in uniformity, the distribution of cellular particles is denser, and the hardness and the corrosion resistance of the plated layer are obviously improved; under the premise that mold die needs not be relatively greatly adjusted, various kinds of high-quality micromorphology are efficiently obtained; and meanwhile, component-controllable preparation of the plated layer and reconfiguration control of a crystal structure can be achieved by changing chemical components of the chemical plating solution, a flexible machining system can be constructed, the machining cost can be reduced, and the machining efficiency and the machining quality can be improved.

Description

technical field [0001] The invention belongs to the technical field of optical element processing, and in particular relates to an electroless plating solution for preparing Ni-P (nickel-phosphorus alloy) coatings for processing micro-nano moulds. The invention also provides a method for controllably preparing a micro-nano mold using the electroless plating solution. Background technique [0002] Optical micro-nano array refers to the arrangement and combination of a certain number of micro-nano-scale lenses or prisms. Because of its special geometric characteristics, it has excellent imaging characteristics and diffraction performance that traditional optical elements do not have. It is an important optical element in modern optical engineering. device. Optical micro-nano arrays with different materials, unit shapes and period sizes have various optical properties, which can be used not only for their imaging properties, but also for their diffraction properties to achieve...

Claims

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Application Information

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IPC IPC(8): C23C18/36C23C18/16
CPCC23C18/1666C23C18/36
Inventor 周天丰刘洋董晓彬于谦梁志强王西彬
Owner BEIJING INSTITUTE OF TECHNOLOGYGY
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