Composite type heat dissipation structure

A heat dissipation structure and composite technology, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of flat cooling fins, reduced heat dissipation efficiency, poor thermal conductivity, etc.

Inactive Publication Date: 2017-01-11
蔡承恩
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the surface of the heat dissipation fins cannot be as smooth as expected due to the limitation of the process, so there is a gap between the heat dissipation fins and the electronic components, which greatly reduces the heat dissipation efficiency (due to the poor thermal conductivity of air)

Method used

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  • Composite type heat dissipation structure
  • Composite type heat dissipation structure
  • Composite type heat dissipation structure

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example 〕

[0067] First, see Figure 1 to Figure 4 shown, where image 3 for figure 2 A cross-sectional schematic diagram of the A-A section, Figure 4 for image 3 Schematic enlarged detail of part B. The first embodiment of the present invention provides a composite heat dissipation structure H, which includes a carrier plate 1 and a heat sink 2 . The heat sink 2 can be disposed on the carrier plate 1 , and the composite heat dissipation structure H can be disposed on the object to be dissipated (not shown) to dissipate the heat of the object to be dissipated.

[0068] Then, as figure 1 , figure 2 and Figure 4As shown, specifically, the carrier board 1 has an aluminum substrate 11 and a first thermal diffusion radiation layer 12, and the aluminum substrate 11 has a first surface 111 and a second surface 112 opposite to the first surface 111, for example That is, the first surface 111 and the second surface 112 may be an upper surface and a lower surface, respectively. The f...

no. 2 example

[0077] First, see Figure 7 to Figure 9 As shown, the second embodiment of the present invention provides a composite heat dissipation structure H', which includes a carrier plate 1 and a heat sink 2 . Depend on Figure 7 and figure 1 It can be seen from the comparison of the second embodiment that the difference between the second embodiment and the first embodiment is that the composite heat dissipation structure H' provided by the second embodiment can additionally form a gas micro-channel S2.

[0078] Subject to the above, see Figure 4 As shown, the carrier board 1 has an aluminum substrate 11 and a first thermal diffusion radiation layer 12, the aluminum substrate 11 has a first surface 111 and a second surface 112 opposite to the first surface 111, wherein the first thermal diffusion radiation The layer 12 is disposed on the first surface 111 or the second surface 112 of the aluminum substrate 11 . The heat sink 2 is disposed on the carrier board 1 . The heat sink 2...

no. 3 example

[0083] First, see Figure 10 and Figure 11 As shown, the third embodiment of the present invention provides a composite heat dissipation structure H", which includes a carrier plate 1 and a heat sink 2. By Figure 10 and figure 1 By comparison, the difference between the third embodiment and the first embodiment is that the composite heat dissipation structure H" provided by the third embodiment, the carrier plate 1 of which can be formed by the first aluminum substrate 113 and the second aluminum substrate 114 respectively. In addition, the first aluminum substrate 113 and the second aluminum substrate 114 having the main body portion 13, the first side end portion 14 and the second side end portion 15, respectively, can be offset and overlapped with each other, so that the first aluminum substrate 113 and the second aluminum substrate 113 The first side end portion 14 and the second side end portion 15 on the aluminum substrate 114 surround the main body portion 13 .

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Abstract

The invention discloses a composite type heat dissipation structure. The composite type heat dissipation structure comprises a bearing plate and a heat dissipation sheet, wherein the bearing plate is provided with an aluminum substrate and a first heat diffusion radiation layer; the aluminum substrate is provided with a first surface and a second surface which is opposite to the first surface, wherein the first heat diffusion radiation layer is arranged on the first surface or the second surface of the aluminum substrate; the heat dissipation sheet is arranged on the bearing plate; the heat dissipation sheet comprises a copper substrate and a second heat diffusion radiation layer; and the copper substrate is provided with a first surface and a second surface which is opposite to the first surface of the copper substrate, wherein the second heat diffusion radiation layer is arranged on the first surface of the copper substrate.

Description

technical field [0001] The invention relates to a heat dissipation structure, in particular to a composite heat dissipation structure with functions of heat conduction and heat radiation. Background technique [0002] With the high development of electronic devices, the computing efficiency of the electronic components inside the electronic devices is required to be higher and higher, which leads to the easy rise of the temperature of the electronic components, thereby causing the problem of heat dissipation. In addition, with the design trend of electronic devices toward thin and light designs, it is easy to cause the extremely compressed space design to cause heat dissipation difficulties. [0003] Generally speaking, it is a known method to dissipate heat by arranging elements such as fans and heat dissipation fins near the heat source. However, this is not the case with thin and light electronics, such as ultra-thin laptops, tablets, and even smartphones. Therefore, it...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 蔡承恩
Owner 蔡承恩
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