Horizontal type stirring sanding groove for producing efficient composite electroplated diamond wire and use method

Abstract

The invention provides a horizontal type stirring sanding groove for producing an efficient composite electroplated diamond wire and a use method. A horizontal type stirring sanding groove device mainly comprises a sanding groove body, an overflow liquid circulating device, a horizontal type stirring device, a steel wire conveying device, an automatic material supplementing device and the like. The horizontal type stirring device of a stirring paddle with the wide axial covering area is adopted in the sanding groove device, a liquid flow field of the whole axial area of the sanding area is uniform and consistent in distribution, diamond micro powder has the good dispersion effect in a plating solution, the diamond micro powder is not likely to be united on a steel wire, distribution is good, and finished product wires are uniform in diameter; the electroplated diamond wire which is controllable in diamond sanding amount and good in distribution can be continuously produced, the structure is reasonable, operation is convenient and rapid, and running is efficient.

Description

technical field [0001] The invention relates to the field of mechanical cutting, and mainly relates to the cutting application of crystalline silicon wafers in the photovoltaic industry, and in particular to a sand tank device for producing composite electroplated diamond cutting lines and a method of use thereof. Background technique [0002] With the rapid development of semiconductor, integrated circuit and photovoltaic industries, the application of hard and brittle materials such as sapphire and crystalline silicon has become more and more extensive, and higher requirements have been put forward for their cutting and processing technology. At present, the relatively mature cutting process is the free abrasive wire cutting technology, that is, the abrasive mortar is supplied to the saw wire while cutting the hard blank. The main problems of this process are: (1) the loss of the formed saw kerf is large, and the yield is low; (2) it is difficult for abrasives to enter the...

AI Technical Summary

Problems solved by technology

The main problems of this process are: (1) the loss of the formed saw kerf is large, and the yield is low; (2) it is difficult for abrasives to enter the long and deep kerf when cutting large-sized blanks, and the flatness and surface quality of the cut surface are prone to defects (3) The circulation of mortar is large, and a large amount of mortar needs to be recycled; (4) Since the sawing action is based on the principle of three-body wear between the cutting line, the abrasive and the material to be cut, the abrasive will also act on the cutting line, shorten its life

The difficulty lies in the fact that during diamond composite electroplating, the steel wire is in continuous wire movement, and it is relatively difficult for the diamond to be consolidated on the steel wire. Easy to fall off under action

The method of increasing the concentration of diamond micropowder in the plating solution certainly helps to enhance the consolidation ability by increasing the contact probability between sand and wire, but because the density of diamond micropowder is much larger than that of the electroplating solution, and there is a certain adhesion between diamond micropowder particles , it is difficult to fully disperse the diamond micropowder particles in the electroplating solution, and the effect of poor dispersion will directly cause the diamond particles to agglomerate on the steel wire, which will further lead to poor uniformity of the diamond wire diameter and easy cutting during the cutting process. Breakage, deep cutting depth of the material to be cut, scratches on the cutting surface, etc.

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