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Prepreg, preparation method of prepreg and composite material

A composite material and prepreg technology, applied in the field of prepreg, composite material, and its preparation, can solve the problems of hollow microspheres such as low density, easy to float, and no solution, so as to reduce the dielectric constant and dielectric loss , Improve mechanical strength, improve the effect of stability

Inactive Publication Date: 2017-01-11
KUANG CHI INST OF ADVANCED TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when the above-mentioned hollow microspheres are used to prepare prepregs, there are usually the following two disadvantages: 1) hollow microspheres are easily damaged during the processing of prepregs; 2) during the preparation of prepregs , because the hollow microspheres have a very low density, they are easy to float in the mixed glue, which leads to the instability of the mixed glue
For the above problems, there is currently no effective solution

Method used

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  • Prepreg, preparation method of prepreg and composite material

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preparation example Construction

[0034] According to another aspect of the present invention, a kind of preparation method of prepreg is provided, such as figure 1 As shown, the preparation method includes the following steps: uniformly mixing epoxy resin and expanded microspheres to form a mixed glue, the outer shell of the expanded microspheres is a thermoplastic material, the inside of the expanded microspheres is filled with a foaming agent, and the mixed glue The weight percent of the expanded microspheres is 2-10wt%. The fiber body and the mixed glue solution are impregnated to form a prepreg.

[0035] The above-mentioned preparation method mixes the epoxy resin and the expanded microspheres uniformly to form a mixed glue, and utilizes the outer shell of the expanded microspheres as a thermoplastic material and the inside as a foaming agent, so that the expanded microspheres have a larger density than the hollow microspheres. The properties of the density, thereby reducing the floating of the expanded m...

Embodiment 1

[0046] The steps of the preparation method of the prepreg provided in this embodiment include:

[0047] Heat the bisphenol A type epoxy resin with a viscosity of 20000CPS at 70°C and add the expanded microspheres, and stir evenly to form a mixed glue, wherein the diameter of the expanded microspheres is 10 μm, and the expanded microspheres in the mixed glue The weight percentage is 5wt%; put the mixed glue solution into the glue film machine and carry out gelation at 80°C to form a glue film; finally put the untwisted aramid fiber bundle and the above glue film into the impregnation machine and heat it at the hot pressing temperature 100°C, hot pressing pressure 10kg / cm 2 Continuous hot pressing under certain conditions to form a prepreg, wherein the weight ratio of bisphenol A epoxy resin, expanded microspheres and untwisted aramid fiber bundles is 1:0.05:0.01.

Embodiment 2

[0049] The steps of the preparation method of the prepreg provided in this embodiment include:

[0050] Heat the bisphenol A type epoxy resin with a viscosity of 10000CPS at 50°C and add the expanded microspheres, and stir evenly to form a mixed glue, wherein the diameter of the expanded microspheres is 5 μm, and the expanded microspheres in the mixed glue The weight percentage is 2wt%; Put the mixed glue solution into the glue film machine to form a glue at 50°C to form a glue film; finally put the plain quartz fiber cloth and the above glue film into the impregnation machine and heat it at a hot pressing temperature of 50 ℃, hot pressing pressure is 5kg / cm 2 Continuous hot pressing under certain conditions to form a prepreg, wherein the weight ratio of bisphenol A epoxy resin, expanded microspheres and plain quartz fiber cloth is 1:0.15:0.15.

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Abstract

The invention provides a prepreg, a preparation method of the prepreg and a composite material. The prepreg is an impregnation compound comprising epoxy resin, expended microspheres and a fiber body. The invention provides a prepreg of the impregnation compound comprising the epoxy resin, expended microspheres and the fiber body, wherein the shell of the expended microspheres is a thermoplastic material, and a foaming agent is filled in the shell, so that the expended microspheres have higher density than hollow microspheres, and the stability of the mixed glue solution is further improved. Moreover, because the expended microspheres with a certain weight percentage exist in the prepreg, the content of other medium materials in the prepreg is reduced; and because the dielectric constant of the other medium materials is higher than the dielectric constant of the expended microspheres, the dielectric constant and dielectric loss of the prepreg are reduced.

Description

technical field [0001] The invention relates to the technical field of prepreg preparation, in particular to a prepreg, its preparation method and composite material. Background technique [0002] Prepreg is a semi-finished product (intermediate substrate) for preparing fiber-reinforced resin-based composite materials, and its quality directly determines the performance of composite product components. At present, the production process of prepreg mainly includes wet method and dry method. The wet method is also called the solution impregnation method, which requires the use of a large amount of volatile solvents. The dry method is also called the hot melt method. It has the characteristics of high production efficiency, strong controllability of resin content in prepreg, low volatile matter, good appearance quality and excellent comprehensive performance. App trend. [0003] In the prior art, in order to minimize the weight of the composite material, hollow microspheres ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L97/02C08L23/12C08L77/10C08K7/06C08K7/14C08K7/10C08J9/14
Inventor 不公告发明人
Owner KUANG CHI INST OF ADVANCED TECH
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