Machining method for etching front surface of silica glass through laser with assistance of chemical salt film

Abstract

The invention provides a method for etching the front surface of silica glass with the assistance of a chemical salt film, belonging to the field of non-traditional machining. The machining method provided by the invention mainly comprises the four steps that (1), the silica glass is heated by an electric heating wire; a saturated copper sulfate solution is slowly added to the surface of the silica glass; copper sulfate crystals are continuously precipitated in the solution on the surface of the silica glass until a layer of very thin and uniform chemical salt film is formed on the surface of the silica glass; (2), the silica glass is clamped on a laser worktable, and laser system technological parameters of laser for etching the silica glass are determined; (3), a laser scanning path and laser scanning speed are determined; and (4), the silica glass of which the surface is provided with the chemical salt film is etched through the laser according to the scanning path. According to the method, laser energy is mainly absorbed by the chemical salt film in an assistant manner, so that a laser beam is prevented from being transmitted through the silica glass, and the laser beam emitted by a solid laser can perform etching on the surface of the silica glass. By adopting the method provided by the invention, obvious slags and edge breakage do not exist on the surfaces of grooves etched on the surface of the silica glass, and the surfaces are smooth and clean; and a good machining effect is reached.

Description

[0001] Technical field: [0002] The invention relates to a processing method for front-side etching of quartz glass assisted by chemical salt film, which belongs to the application field of special processing. [0003] Background technique: [0004] Due to a series of excellent physical and chemical properties such as high hardness, good thermal performance, acid and alkali resistance, high insulation, high light transmittance to various bands and good chemical stability, quartz glass has become a popular choice in optoelectronics, microelectronics, optics and optical fiber industries. With the development of modern science and technology, the processing precision and surface quality of quartz glass have very high requirements, but because quartz glass is a hard and brittle material with high brittleness and low toughness, the processing of this material is difficult. Traditional processing methods such as chemical etching, plasma etching, mechanical cutting, mechanical grindi...

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Problems solved by technology

[0004] Due to a series of excellent physical and chemical properties such as high hardness, good thermal performance, acid and alkali resistance, high insulation, high light transmittance to various bands and good chemical stability, quartz glass has become a popular choice in optoelectronics, microelectronics, optics and optical fiber industries. With the development of modern science and technology, the processing precision and surface quality of quartz glass have very high requirements, but because quartz glass is a hard and brittle material with high brittleness and low toughness, the processing of this material is difficult. Traditional processing methods such as chemical etching, plasma etching, mechanical cutting, mechanical grinding and polishing, hot air cutting, ultrasonic blanking, abrasive jetting, etc. have their own advantages, but there is a common problem of precise control. , Relatively low erosion rate and other disadvantages

[0005] Laser etching technology is a non-contact, non-cutting, and heat-influenced processing method. It has the advantages of excellent processing quality, high efficiency, wide processing range, cleanliness, good economic benefits, easy implementation of automatic control, flexible processing and Features such as intelligent processing solve the problems that cannot be solved by traditional processing technology. However, there are also some problems in laser etching. Although solid-state lasers use plasma back wet etching of quartz glass, although the precision is high, the etching depth is shallow and the etching rate is relatively high. Low; while the plasma back dry-etched quartz glass, the etching depth is relatively large, but since the etching is performed from the back of the quartz glass, the slag generated during the etching process cannot be removed in time by auxiliary gas or auxiliary liquid. Therefore, more slag remains on the etched surface, and there is a serious chipping phenomenon, which will directly affect the surface processing quality of quartz glass

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